title: A combined top-down bottom-up approach for introducing nanoparticle networks into nanoelectrode gaps.
abstract: We report here on the fabrication of a three-dimensional array of nanoparticles which bridges the gap between lithographically defined gold electrode contacts separated by 20 nm. The nanoparticle assemblies are formed from about 5 nm gold nanoparticles and benzenedimethanethiol (BDMT) bridging ligands. These assemblies are introduced between the contacts using a layer-by-layer protocol with successive BDMT self-assembly being followed by nanoparticle adsorption until the gap is bridged. The temperature dependent electrical properties of these devices are analysed to establish whether they are consistent with the notion that the networks are built up from molecularly interlinked discrete gold nanoparticles. To aid this analysis the molecular conductance of single bridging molecules is also characterized at room temperature using a recently introduced method based on the scanning tunnelling microscope (STM). From these measurements it is concluded that the room temperature electrical properties of the nanostructured networks are limited by the small interparticle connectivity and the inherent resistance of the linker molecules.
authors: Department of Electronics and Electrical Engineering, University of Glasgow, Glasgow G12 8LT, UK.
authors: Cigang
authors: C
authors: Xu
authors: Harm
authors: H
authors: van Zalinge
authors: John L
authors: JL
authors: Pearson
authors: Andrew
authors: A
authors: Glidle
authors: Jonathan M
authors: JM
authors: Cooper
authors: David R S
authors: DR
authors: Cumming
authors: Wolfgang
authors: W
authors: Haiss
authors: Jianlin
authors: J
authors: Yao
authors: David J
authors: DJ
authors: Schiffrin
authors: María
authors: M
authors: Proupín-Pérez
authors: Richard
authors: R
authors: Cosstick
authors: Richard J
authors: RJ
authors: Nichols