Effect of the C-factor and dentin preparation method in the bond strength of a mild self-etch adhesive.
This study evaluated the effect of the C-factor and dentin preparation method (DPM) in the bond strength (BS) of a mild self-etch adhesive; the study also observed the SEM superficial aspects of the corresponding smear layer. For purposes of this study, 25 molars (n=5) were used in a bond strength test. The molars were divided into two parts (buccal and lingual): one part received a Class V cavity (C-factor=3) and the other received a flat surface (C-factor=0) with the same bur type (coarse diamond or carbide bur and fine diamond or carbide bur), both within the same dentin depth. Five teeth were prepared with wet 60-grit and 600-grit SiC papers. After restoration with Clearfil SE Bond, microtensile beans (0.8 mm2) were prepared and tested after 24 hours in a universal testing machine (0.5 mm/minute). An additional two teeth for each DPM were prepared for SEM evaluation of the smear layer superficial aspects. The BS values were submitted to one-way ANOVA, considering only the DPM (flat surfaces) and two-way ANOVA (C-Factor x DPM, considering only burs) with p=0.05. Although the DPM in the flat surfaces was not significant, the standard deviations of carbide bur-prepared specimens were markedly lower. The BS was significantly lower in cavities. The fine carbide bur presented the most favorable smear layer aspect. It was concluded that different dentin preparation methods could not prevent the adverse effect in bond strength of a high C-factor. A coarse cut carbide bur should be avoided prior to a mild self-etch adhesive, because it adversely affected bond strength. In contrast, a fine cut carbide bur provided the best combination: high bond strength with low variability, which suggests a more reliable bond strength performance.
Marques
M S M
MS
Department of Dental Materials, School of Dentistry, University of São Paulo, São Paulo, Brazil.
Kenshima
S
S
Muench
A
A
Ballester
R Y
RY
Rodrigues Filho
L E
LE
D001840:Dental Bonding; D003737:Dental Cavity Preparation; D003738:Dental Cements; D045662:Dental Etching; D003754:Dental High-Speed Equipment; D003799:Dental Stress Analysis; D003804:Dentin / Q000648:ultrastructure*; D017220:Dentin-Bonding Agents; D006801:Humans; D066298:In Vitro Techniques; D008963:Molar
D003738:Dental Cements; D017220:Dentin-Bonding Agents