title: The fabrication of diversiform nanostructure forests based on residue nanomasks synthesized by oxygen plasma removal of photoresist.
abstract: A simple lithography-free approach for fabricating diversiform nanostructure forests is presented. The key technique of the approach is that randomly distributed nanoscale residues can be synthesized on substrates simply by removing photoresist with oxygen plasma bombardment. These nanoresidues can function as masks in the subsequent etching process for nanopillars. By further spacer and then deep etching processes, a variety of forests composed of regular, tulip-like or hollow-head nanopillars as well as nanoneedles are successfully achieved in different etching conditions. The pillars have diameters of 30-200 nm and heights of 400 nm-3 microm. The needles reach several microns in height, with their tips less than 10 nm in diameter. Moreover, microstructures containing these nanostructure forests, such as surface microchannels, have also been fabricated. This approach is compatible with conventional micro/nano-electromechanical system (MEMS/NEMS) fabrication.
authors.affiliation: National Key Laboratory of Science and Technology on Micro/Nano Fabrication, Institute of Microelectronics, Peking University, Beijing 100871, People's Republic of China.
authors.forename: Haiyang
authors.initials: H
authors.lastname: Mao
authors.forename: Di
authors.initials: D
authors.lastname: Wu
authors.forename: Wengang
authors.initials: W
authors.lastname: Wu
authors.forename: Jun
authors.initials: J
authors.lastname: Xu
authors.forename: Yilong
authors.initials: Y
authors.lastname: Hao
mesh_terms: D003300:Copper / Q000737:chemistry; D004852:Epoxy Compounds / Q000737:chemistry; D017611:Fluorine Compounds / Q000737:chemistry; D006046:Gold / Q000737:chemistry; D057927:Hydrophobic and Hydrophilic Interactions; D008855:Microscopy, Electron, Scanning; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure; D036103:Nanotechnology / Q000295:instrumentation / Q000379:methods*; D010100:Oxygen / Q000737:chemistry*; D011108:Polymers / Q000737:chemistry; D012822:Silicon Dioxide / Q000737:chemistry; D013997:Time Factors; D014867:Water / Q000737:chemistry
chemical_list: D004852:Epoxy Compounds; D017611:Fluorine Compounds; D011108:Polymers; C520895:SU-8 compound; D014867:Water; D006046:Gold; D012822:Silicon Dioxide; D003300:Copper; D010100:Oxygen