Copper plating on the polyimide film by electroless plating techniques for EMI shielding.
In this work, the metal plated film was prepared by electroless plating techniques. The film was prepared for the fabrication of EMI shielding. Polyimide film was treated by base solution for etching and then activated by silver. The modified polyimide film was immersed into the electroless copper plating solution which has different molar ratios of nickel in the solution. The thickness and surface morphology of copper layer on the polyimide films were characterized with scanning electron microscopy (SEM). Furthermore, EMI shielding ability of the film was calculated by measuring reflectivity of EM wave on the film surface using the equation of Schelkunoff theory.
Ji
Eun Sun
ES
Department of Chemistry, Sogang University, Seoul 121-742, Korea.
Cha
Hyun Gil
HG
Kim
Chang Woo
CW
Kang
Dong In
DI
Kang
Young Soo
YS