Towards circuit integration on fully flexible parylene substrates.
We present a substrate transfer technology which allows devices to be fully processed using conventional silicon-based fabrication techniques prior to their integration with parylene. A parylene-based metal microelectrode array with high-temperature silicon oxide passivation layers was demonstrated. Combining high quality devices from well-established processes with thin, flexible and biocompatible substrates, this technology could provide exciting opportunities, especially in biomedical applications such as implantable neural interfaces.
Wang
Ke
K
Minimally Invasive Healthcare Department, Philips Research, Eindhoven, The Netherlands. ke.wang@philips.com
van Deurzen
Marice
M
Kooyman
Nico
N
Decre
Michel M J
MM
D004867:Equipment Design; D019544:Equipment Failure Analysis; D008422:Materials Testing; D008839:Microelectrodes; D011108:Polymers / Q000737:chemistry*; D018511:Systems Integration; D014992:Xylenes / Q000737:chemistry*
D011108:Polymers; D014992:Xylenes; C011055:parylene