title: Towards circuit integration on fully flexible parylene substrates.
abstract: We present a substrate transfer technology which allows devices to be fully processed using conventional silicon-based fabrication techniques prior to their integration with parylene. A parylene-based metal microelectrode array with high-temperature silicon oxide passivation layers was demonstrated. Combining high quality devices from well-established processes with thin, flexible and biocompatible substrates, this technology could provide exciting opportunities, especially in biomedical applications such as implantable neural interfaces.
authors: Minimally Invasive Healthcare Department, Philips Research, Eindhoven, The Netherlands. ke.wang@philips.com
authors: Ke
authors: K
authors: Wang
authors: Marice
authors: M
authors: van Deurzen
authors: Nico
authors: N
authors: Kooyman
authors: Michel M J
authors: MM
authors: Decre
mesh_terms: D004867:Equipment Design; D019544:Equipment Failure Analysis; D008422:Materials Testing; D008839:Microelectrodes; D011108:Polymers / Q000737:chemistry*; D018511:Systems Integration; D014992:Xylenes / Q000737:chemistry*
chemical_list: D011108:Polymers; D014992:Xylenes; C011055:parylene