title: First-principles simulations of conditions of enhanced adhesion between copper and TaN(111) surfaces using a variety of metallic glue materials.
authors: Engineering Research Center of Nano-Geomaterials of Ministry of Education and Institute of Theoretical Chemistry and Computational Materials Science, China University of Geosciences Wuhan, 388 Lumo RD, Wuhan 430074, China.
authors: Bo
authors: B
authors: Han
authors: Jinping
authors: J
authors: Wu
authors: Chenggang
authors: C
authors: Zhou
authors: Bei
authors: B
authors: Chen
authors: Roy
authors: R
authors: Gordon
authors: Xinjian
authors: X
authors: Lei
authors: David A
authors: DA
authors: Roberts
authors: Hansong
authors: H
authors: Cheng
mesh_terms: D000535:Aluminum / Q000737:chemistry; D003300:Copper / Q000737:chemistry*; D056004:Molecular Dynamics Simulation; D009584:Nitrogen / Q000737:chemistry*; D012428:Ruthenium / Q000737:chemistry; D013499:Surface Properties; D013635:Tantalum / Q000737:chemistry*
chemical_list: D013635:Tantalum; D003300:Copper; D012428:Ruthenium; D000535:Aluminum; D009584:Nitrogen