First-principles simulations of conditions of enhanced adhesion between copper and TaN(111) surfaces using a variety of metallic glue materials.
Han
Bo
B
Engineering Research Center of Nano-Geomaterials of Ministry of Education and Institute of Theoretical Chemistry and Computational Materials Science, China University of Geosciences Wuhan, 388 Lumo RD, Wuhan 430074, China.
Wu
Jinping
J
Zhou
Chenggang
C
Chen
Bei
B
Gordon
Roy
R
Lei
Xinjian
X
Roberts
David A
DA
Cheng
Hansong
H
D000535:Aluminum / Q000737:chemistry; D003300:Copper / Q000737:chemistry*; D056004:Molecular Dynamics Simulation; D009584:Nitrogen / Q000737:chemistry*; D012428:Ruthenium / Q000737:chemistry; D013499:Surface Properties; D013635:Tantalum / Q000737:chemistry*
D013635:Tantalum; D003300:Copper; D012428:Ruthenium; D000535:Aluminum; D009584:Nitrogen