Electrically-pumped compact hybrid silicon microring lasers for optical interconnects.
We demonstrate an electrically-pumped hybrid silicon microring laser fabricated by a self-aligned process. The compact structure (D = 50 microm) and small electrical and optical losses result in lasing threshold as low as 5.4 mA and up to 65 degrees C operation temperature in continuous-wave (cw) mode. The spectrum is single mode with large extinction ratio and small linewidth observed. Application as on-chip optical interconnects is discussed from a system perspective.
Liang
Di
D
Department of Electrical and Computer Engineering, University of California, Santa Barbara, CA 93106, USA. dliang@ece.ucsb.edu
Fiorentino
Marco
M
Okumura
Tadashi
T
Chang
Hsu-Hao
HH
Spencer
Daryl T
DT
Kuo
Ying-Hao
YH
Fang
Alexander W
AW
Dai
Daoxin
D
Beausoleil
Raymond G
RG
Bowers
John E
JE
D017076:Computer-Aided Design; D004581:Electronics / Q000295:instrumentation*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D007834:Lasers; D007909:Lenses; D008904:Miniaturization; D012031:Refractometry / Q000295:instrumentation*; D015203:Reproducibility of Results; D012680:Sensitivity and Specificity; D012825:Silicon / Q000737:chemistry*
D012825:Silicon