title: Compact and passive-alignment 4-channel x 2.5-Gbps optical interconnect modules based on silicon optical benches with 45 degrees micro-reflectors.
abstract: Compact and passive-alignment 4-channel x 2.5-Gbps optical interconnect modules are developed based on the silicon optical benches (SiOBs) of 5 x 5 mm2. A silicon-based 45 degrees micro-reflector and V-groove arrays are fabricated on the SiOB using anisotropic wet etching. Moreover, high-frequency transmission lines of 4 channel x 2.5 Gbps, and bonding pads with Au/Sn eutectic solder are also deposited on the SiOB. The vertical-cavity surface-emitting laser (VCSEL) array and photo-detector (PD) array are flip-chip assembled on the intended positions. The multi-mode fiber (MMF) ribbons are passively aligned and mounted onto the V-groove arrays. Without the assistance of additional optics, the coupling efficiencies of VCSEL-to-MMF in the transmitting part and MMF-to-PD in the receiving part can be as high as -5.65 and -1.98 dB, respectively, under an optical path of 180 microm. The 1-dB coupling tolerance of greater than +/- 20 microm is achieved for both transmitting and receiving parts. Eye patterns of both parts are demonstrated using 15-bit PRBS at 2.5 Gbps.
authors.affiliation: Department of Optics and Photonics, National Central University, Jhong-li, 32001, Taiwan.
authors.forename: Hsu-Liang
authors.initials: HL
authors.lastname: Hsiao
authors.forename: Hsiao-Chin
authors.initials: HC
authors.lastname: Lan
authors.forename: Chia-Chi
authors.initials: CC
authors.lastname: Chang
authors.forename: Chia-Yu
authors.initials: CY
authors.lastname: Lee
authors.forename: Siou-Ping
authors.initials: SP
authors.lastname: Chen
authors.forename: Chih-Hung
authors.initials: CH
authors.lastname: Hsu
authors.forename: Shuo-Fu
authors.initials: SF
authors.lastname: Chang
authors.forename: Yo-Shen
authors.initials: YS
authors.lastname: Lin
authors.forename: Feng-Ming
authors.initials: FM
authors.lastname: Kuo
authors.forename: Jin-Wei
authors.initials: JW
authors.lastname: Shi
authors.forename: Mount-Learn
authors.initials: ML
authors.lastname: Wu
mesh_terms: D017076:Computer-Aided Design; D004867:Equipment Design; D019544:Equipment Failure Analysis; D007834:Lasers; D007909:Lenses; D008872:Microwaves; D008904:Miniaturization; D010783:Photometry / Q000295:instrumentation*; D012031:Refractometry / Q000295:instrumentation*; D012825:Silicon / Q000737:chemistry*; D018511:Systems Integration; D013685:Telecommunications / Q000295:instrumentation*
chemical_list: D012825:Silicon