Compact and passive-alignment 4-channel x 2.5-Gbps optical interconnect modules based on silicon optical benches with 45 degrees micro-reflectors.
Compact and passive-alignment 4-channel x 2.5-Gbps optical interconnect modules are developed based on the silicon optical benches (SiOBs) of 5 x 5 mm2. A silicon-based 45 degrees micro-reflector and V-groove arrays are fabricated on the SiOB using anisotropic wet etching. Moreover, high-frequency transmission lines of 4 channel x 2.5 Gbps, and bonding pads with Au/Sn eutectic solder are also deposited on the SiOB. The vertical-cavity surface-emitting laser (VCSEL) array and photo-detector (PD) array are flip-chip assembled on the intended positions. The multi-mode fiber (MMF) ribbons are passively aligned and mounted onto the V-groove arrays. Without the assistance of additional optics, the coupling efficiencies of VCSEL-to-MMF in the transmitting part and MMF-to-PD in the receiving part can be as high as -5.65 and -1.98 dB, respectively, under an optical path of 180 microm. The 1-dB coupling tolerance of greater than +/- 20 microm is achieved for both transmitting and receiving parts. Eye patterns of both parts are demonstrated using 15-bit PRBS at 2.5 Gbps.
Hsiao
Hsu-Liang
HL
Department of Optics and Photonics, National Central University, Jhong-li, 32001, Taiwan.
Lan
Hsiao-Chin
HC
Chang
Chia-Chi
CC
Lee
Chia-Yu
CY
Chen
Siou-Ping
SP
Hsu
Chih-Hung
CH
Chang
Shuo-Fu
SF
Lin
Yo-Shen
YS
Kuo
Feng-Ming
FM
Shi
Jin-Wei
JW
Wu
Mount-Learn
ML
D017076:Computer-Aided Design; D004867:Equipment Design; D019544:Equipment Failure Analysis; D007834:Lasers; D007909:Lenses; D008872:Microwaves; D008904:Miniaturization; D010783:Photometry / Q000295:instrumentation*; D012031:Refractometry / Q000295:instrumentation*; D012825:Silicon / Q000737:chemistry*; D018511:Systems Integration; D013685:Telecommunications / Q000295:instrumentation*
D012825:Silicon