title: Note: Anodic bonding with cooling of heat-sensitive areas.
abstract: Anodic bonding of silicon to glass always involves heating the glass and device to high temperatures so that cations become mobile in the electric field. We present a simple way of bonding thin silicon samples to borosilicate glass by means of heating from the glass side while locally cooling heat-sensitive areas from the silicon side. Despite the high thermal conductivity of silicon, this method allows a strong anodic bond to form just millimeters away from areas essentially at room temperature.
authors.affiliation: Department of Physics, CINF, Technical University of Denmark (DTU), Building 312, Fysikvej, DK-2800 Kgs. Lyngby, Denmark. peter.vesborg@fysik.dtu.dk
authors.forename: Peter C K
authors.initials: PC
authors.lastname: Vesborg
authors.forename: Jakob L
authors.initials: JL
authors.lastname: Olsen
authors.forename: Toke R
authors.initials: TR
authors.lastname: Henriksen
authors.forename: Ib
authors.initials: I
authors.lastname: Chorkendorff
authors.forename: Ole
authors.initials: O
authors.lastname: Hansen