Note: Anodic bonding with cooling of heat-sensitive areas.
Anodic bonding of silicon to glass always involves heating the glass and device to high temperatures so that cations become mobile in the electric field. We present a simple way of bonding thin silicon samples to borosilicate glass by means of heating from the glass side while locally cooling heat-sensitive areas from the silicon side. Despite the high thermal conductivity of silicon, this method allows a strong anodic bond to form just millimeters away from areas essentially at room temperature.
Vesborg
Peter C K
PC
Department of Physics, CINF, Technical University of Denmark (DTU), Building 312, Fysikvej, DK-2800 Kgs. Lyngby, Denmark. peter.vesborg@fysik.dtu.dk
Olsen
Jakob L
JL
Henriksen
Toke R
TR
Chorkendorff
Ib
I
Hansen
Ole
O