title: Anodically bonded submicron microfluidic chambers.
abstract: We demonstrate the use of anodic bonding to fabricate cells with characteristic size as large as 7 x 10 mm(2), with height of approximately 640 nm, and without any internal support structure. The cells were fabricated from Hoya SD-2 glass and silicon wafers, each with 3 mm thickness to maintain dimensional stability under internal pressure. Bonding was carried out at 350 degrees C and 450 V with an electrode structure that excluded the electric field from the open region. We detail fabrication and characterization steps and also discuss the design of the fill line for access to the cavity.
authors.affiliation: Department of Physics, Cornell University, Ithaca, New York 14853, USA.
authors.forename: S
authors.initials: S
authors.lastname: Dimov
authors.forename: R G
authors.initials: RG
authors.lastname: Bennett
authors.forename: A
authors.initials: A
authors.lastname: Córcoles
authors.forename: L V
authors.initials: LV
authors.lastname: Levitin
authors.forename: B
authors.initials: B
authors.lastname: Ilic
authors.forename: S S
authors.initials: SS
authors.lastname: Verbridge
authors.forename: J
authors.initials: J
authors.lastname: Saunders
authors.forename: A
authors.initials: A
authors.lastname: Casey
authors.forename: J M
authors.initials: JM
authors.lastname: Parpia