Knocking down highly-ordered large-scale nanowire arrays.
The large-scale assembly of nanowire elements with controlled and uniform orientation and density at spatially well-defined locations on solid substrates presents one of the most significant challenges facing their integration in real-world electronic applications. Here, we present the universal "knocking-down" approach, based on the controlled in-place planarization of nanowire elements, for the formation of large-scale ordered nanowire arrays. The controlled planarization of the nanowires is achieved by the use of an appropriate elastomer-covered rigid-roller device. After being knocked down, each nanowire in the array can be easily addressed electrically, by a simple single photolithographic step, to yield a large number of nanoelectrical devices with an unprecedented high-fidelity rate. The approach allows controlling, in only two simple steps, all possible array parameters, that is, nanowire dimensions, chemical composition, orientation, and density. The resulting knocked-down arrays can be further used for the creation of massive nanoelectronic-device arrays. More than million devices were already fabricated with yields over 98% on substrate areas of up, but not limited to, to 10 cm(2).
Pevzner
Alexander
A
School of Chemistry, Tel-Aviv University, Tel Aviv, Israel.
Engel
Yoni
Y
Elnathan
Roey
R
Ducobni
Tamir
T
Ben-Ishai
Moshit
M
Reddy
Koteeswara
K
Shpaisman
Nava
N
Tsukernik
Alexander
A
Oksman
Mark
M
Patolsky
Fernando
F
D004129:Dimethylpolysiloxanes / Q000737:chemistry; D008422:Materials Testing; D036103:Nanotechnology / Q000295:instrumentation* / Q000379:methods; D053770:Nanowires / Q000737:chemistry*; D009757:Nylons / Q000737:chemistry; D013499:Surface Properties
D004129:Dimethylpolysiloxanes; D009757:Nylons; C085707:poly(dimethylsiloxane)-polyamide copolymer