Alignment of microcircuit chips using optically smeared images.
An optical method for determining the position of microcircuit chips for wirebonding or electrical testing stations was evaluated. Optically smearing the chip image in one direction with a cylindrical lens produces a convenient means for determining both chip angular orientation and position. Digitized images from a linear photodiode array camera were analyzed. The results show that a class of microcircuit chips with medium scale integration can be aligned in angle and position to a higher accuracy than required for wirebonding and electrical testing stations.
Lewis
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