Effect of collagenase and esterase on resin-dentin interface: a comparative study between a total-etch adhesive and a self-etch adhesive.
OBJECTIVE
To examine the effects of collagenase and esterase activity on the microtensile bond strength and nanoleakage at the resin-dentin interfaces of two adhesive systems: a total-etch adhesive (Single Bond 2: SB) and a self-etch adhesive (Clearfil SE Bond: SE).


METHODS
Resin composites were bonded to the occlusal dentin surfaces of extracted human premolars with either SB or SE. The bonded teeth were sectioned into beams and assigned to one of four storage conditions: phosphate buffer solution (24 hours), phosphate buffer solution (4 weeks), collagenase solution (4 weeks), or esterase solution (4 weeks). Microtensile bond strength was evaluated and analyzed by two-way ANOVA. Failure mode was analyzed under SEM, and nanoleakage was examined with TEM.


RESULTS
The bond strength of SE was superior to that of SB after 4-week storage in three aqueous solutions. Collagenase and esterase solutions did not decrease the bond strength of SB any more than the phosphate buffer solution (P > 0.05). In regard to SE, the bond strength after 4-week storage in collagenase solution was lower than in the phosphate buffer solution (P < 0.05). TEM images revealed increasing tendency of nanoleakage in the bonded interfaces after storage in collagenase and esterase solutions.
Department of Dentistry, School of Medicine, Ewha Womans University, Seoul, South Korea.
Young-Jung
YJ
Jung
Hong-Keun
HK
Hyun
Young-Jae
YJ
Kim
Ki-Taeg
KT
Jang
D017438:Bisphenol A-Glycidyl Methacrylate / Q000737:chemistry; D002021:Buffers; D043182:Carboxylesterase / Q000737:chemistry*; D017364:Collagenases / Q000737:chemistry*; D003188:Composite Resins / Q000737:chemistry*; D001840:Dental Bonding; D003763:Dental Leakage / Q000145:classification; D003764:Dental Materials / Q000737:chemistry*; D003804:Dentin / Q000648:ultrastructure*; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D006801:Humans; D008422:Materials Testing; D008855:Microscopy, Electron, Scanning; D046529:Microscopy, Electron, Transmission; D019279:Resin Cements / Q000737:chemistry; D013314:Stress, Mechanical; D013718:Tensile Strength; D013997:Time Factors
D002021:Buffers; C438313:Clearfil SE Bond; D003188:Composite Resins; D003764:Dental Materials; D017220:Dentin-Bonding Agents; D019279:Resin Cements; C115612:single bond; D017438:Bisphenol A-Glycidyl Methacrylate; D043182:Carboxylesterase; D017364:Collagenases