title: Morphology and chemical composition of Ag/Sn/Ag interconnections.
abstract: The main goal of the present contribution was to describe morphology and chemical composition of the intermetallic phases, which were formed during diffusion soldering process of the silver using tin. The Ag(3)Sn intermetallics is the main constituent of the joint after diffusion soldering at 235 degrees C and 265 degrees C. A closer inspection of the Ag/Ag(3)Sn interface revealed also the small crystallites of the second intermetallic phase, Ag(5)Sn, which was not previously observed using scanning electron microscope. Both phases are characterized by high melting temperatures: 480 degrees C and 724 degrees C, respectively. Therefore, their presence guarantees high thermal stability of the interconnection, which can be even three times higher than the temperature used for soldering.
authors.affiliation: Institute of Metallurgy and Materials Science, Polish Academy of Sciences, Cracow, Poland. nmskrzyn@imim-pan.krakow.pl
authors.forename: P
authors.initials: P
authors.lastname: Skrzyniarz
authors.forename: J
authors.initials: J
authors.lastname: Wojewoda-Budka
authors.forename: A
authors.initials: A
authors.lastname: Wierzbicka-Miernik
authors.forename: P
authors.initials: P
authors.lastname: Zieba