'Soft' Au, Pt and Cu contacts for molecular junctions through surface-diffusion-mediated deposition.
Virtually all types of molecular electronic devices depend on electronically addressing a molecule or molecular layer through the formation of a metallic contact. The introduction of molecular devices into integrated circuits will probably depend on the formation of contacts using a vapour deposition technique, but this approach frequently results in the metal atoms penetrating or damaging the molecular layer. Here, we report a method of forming 'soft' metallic contacts on molecular layers through surface-diffusion-mediated deposition, in which the metal atoms are deposited remotely and then diffuse onto the molecular layer, thus eliminating the problems of penetration and damage. Molecular junctions fabricated by this method exhibit excellent yield (typically >90%) and reproducibility, and allow examination of the effects of molecular-layer structure, thickness and contact work function.
Bonifas
Andrew P
AP
Department of Materials, Science and Engineering, The Ohio State University, 2041 College Road, Columbus, Ohio, 43210, USA.
McCreery
Richard L
RL
D003460:Crystallization / Q000379:methods; D004058:Diffusion; D055119:Elastic Modulus; D004553:Electric Conductivity; D004595:Electroplating / Q000379:methods*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D046911:Macromolecular Substances / Q000737:chemistry; D008422:Materials Testing; D008670:Metals / Q000737:chemistry*; D008839:Microelectrodes; D008968:Molecular Conformation; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D036103:Nanotechnology / Q000295:instrumentation*; D010316:Particle Size; D013499:Surface Properties
D046911:Macromolecular Substances; D008670:Metals