title: Slow progression of dentin bond degradation during one-year water storage under simulated pulpal pressure.
abstract: OBJECTIVE
  To evaluate the dentin bond durability of simplified adhesives after one-year (1 y) under water storage and simulated pulpal pressure.
  
  
  METHODS
  Class I cavities were prepared in sixty human third molars with the pulpal wall located in mid-coronal dentin. The roots were cut off to expose the pulpal chamber, and the teeth were assembled in a pulpal pressure simulator device. A two-step etch-and-rinse adhesive (Single Bond 2/SB), a two-step self-etch adhesive (Clearfil SE Bond/CSE), a three-step self-etch adhesive (Adper Scotchbond SE/SSE) and three all-in-one adhesives (Adper Easy Bond/EB, Clearfil S(3) Bond/S3 and Adhese One/AO) were applied according to manufacturers instructions. No enamel pre-etching was used for the self-etch systems. The cavities were filled with a composite (Z250, 3M ESPE) in four to five horizontal increments and individually cured. Immediately after the final cure, pulpal pressure was set to 15 cm H(2)O. After 24 h and 1 y under simulate pulpal pressure the teeth were cut following a 'nontrimming' microtensile test technique (n=30) and tested in tension. Kruskall-Wallis and post hoc multiple comparisons were used at alpha=0.05. Weibull statistics was applied to SB, CSE and EB. Fractographic analysis of debonded specimens was performed using scanning electron microscopy.
  
  
  RESULTS
  At 24 h and 1 y periods, SB showed higher bond strength means than all the others adhesives tested. CSE was not statistically different from EB at 24 h and from EB and SB at 1 y. EB showed bond strength statistically higher than the other three self-etch adhesives, which were not statistically different from each other at 24 h. AO showed significantly lower bond strength than all tested materials after 1 y. For all adhesives the mean bond strength at 1 y were not statistically different from the values measured at 24 h (p>0.05). Shifts in failure mode patterns and Weibull modulus decrease indicate some degree of bond degradation after the 1 y storage period.
  
  
  CONCLUSIONS
  One-year of simulated pulpal pressure did not affect dentin bond strength of simplified adhesives in Class I restorations. Signs of degradation were only revealed by fractographic analysis and reliability parameters.
authors.affiliation: Department of Dentistry, School of Dentistry, Federal University of Santa Catarina, Florianópolis, Santa Catarina, Brazil. renanbelli@yahoo.com.br
authors.forename: Renan
authors.initials: R
authors.lastname: Belli
authors.forename: Neimar
authors.initials: N
authors.lastname: Sartori
authors.forename: Lais Dalmagro
authors.initials: LD
authors.lastname: Peruchi
authors.forename: Jackeline Coutinho
authors.initials: JC
authors.lastname: Guimarães
authors.forename: Elito
authors.initials: E
authors.lastname: Araújo
authors.forename: Sylvio
authors.initials: S
authors.lastname: Monteiro
authors.forename: Luiz Narciso
authors.initials: LN
authors.lastname: Baratieri
authors.forename: Ulrich
authors.initials: U
authors.lastname: Lohbauer
mesh_terms: D000180:Acrylic Resins / Q000737:chemistry; D017438:Bisphenol A-Glycidyl Methacrylate / Q000737:chemistry; D055598:Chemical Phenomena; D003188:Composite Resins / Q000737:chemistry; D003737:Dental Cavity Preparation / Q000379:methods; D003782:Dental Pulp / Q000502:physiology*; D003793:Dental Restoration, Permanent / Q000379:methods; D003804:Dentin / Q000648:ultrastructure*; D017220:Dentin-Bonding Agents / Q000737:chemistry*; D006801:Humans; D055115:Light-Curing of Dental Adhesives; D008422:Materials Testing; D008855:Microscopy, Electron, Scanning; D011312:Pressure; D019279:Resin Cements / Q000737:chemistry; D013314:Stress, Mechanical; D013499:Surface Properties; D013718:Tensile Strength; D013997:Time Factors; D014867:Water / Q000737:chemistry
chemical_list: D000180:Acrylic Resins; C489662:AdheSE cement; C505694:Clearfil S3 Bond; C438313:Clearfil SE Bond; D003188:Composite Resins; D017220:Dentin-Bonding Agents; C444701:Filtek Z250; D019279:Resin Cements; C115612:single bond; D014867:Water; D017438:Bisphenol A-Glycidyl Methacrylate; C041330:Scotchbond