Investigations of femtosecond-nanosecond dual-beam laser ablation of dielectrics.
We have conducted experimental investigations for the micromachining of dielectrics (fused silica) using an integrated femtosecond (fs) and nanosecond (ns) dual-beam laser system at different time delays between the fs and ns pulses. We found that the maximum ablation enhancement occurs when the fs pulse is shot near the peak of the ns pulse envelope. Enhancements up to 13.4 times in ablation depth and 50.7 times in the amount of material removal were obtained, as compared to fs laser ablation alone. The fs pulse increases the free electron density and changes the optical properties of fused silica to have metallic characteristics, which increases the absorption of the ns laser energy. This study provides an opportunity for efficient micromachining of dielectrics.
Lin
Cheng-Hsiang
CH
Department of Engineering Science, National Cheng Kung University, Tainan 701, Taiwan.
Rao
Zheng-Hua
ZH
Jiang
Lan
L
Tsai
Wu-Jung
WJ
Wu
Ping-Han
PH
Chien
Chih-Wei
CW
Chen
Shean-Jen
SJ
Tsai
Hai-Lung
HL