title: Novel electroless copper deposition on carbon fibers with environmentally friendly processes.
abstract: A novel electroless deposition (ELD) of copper (Cu) on carbon fibers (CFs) with environmentally friendly processes, silver (Ag) aerosol activation and subsequent nonformaldehyde Cu ELD, was developed. Spark-generated Ag aerosol nanoparticles (approximately 10 nm in mode diameter) were deposited (48.4 microg Ag/g CF in activation intensity) onto the surfaces of CFs. After annealing (at 220 degrees C in a nitrogen atmosphere), the catalytically activated CFs were placed into a solution for Cu ELD (at 82 degrees C). Homogeneous Cu coating (approximately 5.1 nm/min) on CFs was achieved with 90 min of deposition and the corresponding mass deposition rate and Cu grain size for 30-90 min of deposition had ranges of 0.25-1.14 mg Cu/g CF-min and 14.8-37.2 nm, respectively. The porosity of CFs decreased by depositing the Cu for 30-90 min, and the specific surface area and pore volume of CFs decreased from 1536 to 1399 m(2)/g and from 0.65 to 0.57 cm(3)/g, respectively.
authors.affiliation: LCD Division, Samsung Electronics Co., Ltd., Yongin 446-711, Republic of Korea.
authors.forename: Jeong Hoon
authors.initials: JH
authors.lastname: Byeon
authors.forename: Jang-Woo
authors.initials: JW
authors.lastname: Kim