title: Wax-bonding 3D microfluidic chips.
abstract: We report a simple, low-cost and detachable microfluidic chip incorporating easily accessible paper, glass slides or other polymer films as the chip materials along with adhesive wax as the recycling bonding material. We use a laser to cut through the paper or film to form patterns and then sandwich the paper and film between glass sheets or polymer membranes. The hot-melt adhesive wax can realize bridge bonding between various materials, for example, paper, polymethylmethacrylate (PMMA) film, glass sheets, or metal plate. The bonding process is reversible and the wax is reusable through a melting and cooling process. With this process, a three-dimensional (3D) microfluidic chip is achievable by vacuating and venting the chip in a hot-water bath. To study the biocompatibility and applicability of the wax-based microfluidic chip, we tested the PCR compatibility with the chip materials first. Then we applied the wax-paper based microfluidic chip to HeLa cell electroporation (EP). Subsequently, a prototype of a 5-layer 3D chip was fabricated by multilayer wax bonding. To check the sealing ability and the durability of the chip, green fluorescence protein (GFP) recombinant Escherichia coli (E. coli) bacteria were cultured, with which the chemotaxis of E. coli was studied in order to determine the influence of antibiotic ciprofloxacin concentration on the E. coli migration.
authors.affiliation: Department of Physics, The Hong Kong University of Science and Technology, Clear Water Bay, Kowloon, Hong Kong.
authors.forename: Xiuqing
authors.initials: X
authors.lastname: Gong
authors.forename: Xin
authors.initials: X
authors.lastname: Yi
authors.forename: Kang
authors.initials: K
authors.lastname: Xiao
authors.forename: Shunbo
authors.initials: S
authors.lastname: Li
authors.forename: Rimantas
authors.initials: R
authors.lastname: Kodzius
authors.forename: Jianhua
authors.initials: J
authors.lastname: Qin
authors.forename: Weijia
authors.initials: W
authors.lastname: Wen
mesh_terms: D000268:Adhesiveness; D004867:Equipment Design; D019544:Equipment Failure Analysis; D046210:Microfluidic Analytical Techniques / Q000295:instrumentation*; D010209:Paper; D014885:Waxes / Q000737:chemistry*
chemical_list: D014885:Waxes