title: Self-templating growth of copper nanopearl-chain arrays in electrodeposition.
abstract: We report here a unique in-plane self-templating electrochemical growth of arrays of copper nanopearl chains from an ultrathin layer of CuSO4 electrolyte. Scanning electron microscopy indicates that the electrodeposit filaments form equally spaced bundles, which consist of long, straight, pearl-chain-like copper filaments with corrugated periodic structure. The bundle separation can be tuned by changing the applied electric current in electrodeposition. Experiments show that the periodic morphology on the nanopearl chain corresponds to the periodic distribution of copper and cuprous oxide. The mechanism for the bundle formation is discussed.
authors.affiliation: National Laboratory of Solid State Microstructures and Department of Physics, Nanjing University, Nanjing 210093, China.
authors.forename: Yu-Yan
authors.initials: YY
authors.lastname: Weng
authors.forename: Bo
authors.initials: B
authors.lastname: Zhang
authors.forename: Shao-Jie
authors.initials: SJ
authors.lastname: Fu
authors.forename: Mu
authors.initials: M
authors.lastname: Wang
authors.forename: Ru-Wen
authors.initials: RW
authors.lastname: Peng
authors.forename: Guo-Bin
authors.initials: GB
authors.lastname: Ma
authors.forename: Da-Jun
authors.initials: DJ
authors.lastname: Shu
authors.forename: Nai-Ben
authors.initials: NB
authors.lastname: Ming