title: Extremely superhydrophobic surfaces with micro- and nanostructures fabricated by copper catalytic etching.
abstract: We demonstrate a simple method for the fabrication of rough silicon surfaces with micro- and nanostructures, which exhibited superhydrophobic behaviors. Hierarchically rough silicon surfaces were prepared by copper (Cu)-assisted chemical etching process where Cu nanoparticles having particle size of 10-30 nm were deposited on silicon surface, depending on the period of time of electroless Cu plating. Surface roughness was controlled by both the size of Cu nanoparticles and etching conditions. As-synthesized rough silicon surfaces showed water contact angles ranging from 93° to 149°. Moreover, the hierarchically rough silicon surfaces were chemically modified by spin-coating of a thin layer of Teflon precursor with low surface energy. And thus it exhibited nonsticky and enhanced hydrophobic properties with extremely high contact angle of nearly 180°.
authors.affiliation: Interdisciplinary School of Green Energy, Ulsan National Institute of Science and Technology, Banyeon-ri 100, Ulsan 689-798, Korea.
authors.forename: Jung-Pil
authors.initials: JP
authors.lastname: Lee
authors.forename: Sinho
authors.initials: S
authors.lastname: Choi
authors.forename: Soojin
authors.initials: S
authors.lastname: Park
mesh_terms: D002384:Catalysis; D003300:Copper / Q000737:chemistry*; D057927:Hydrophobic and Hydrophilic Interactions; D049329:Nanostructures / Q000737:chemistry*; D010316:Particle Size; D012825:Silicon / Q000737:chemistry*; D013499:Surface Properties
chemical_list: D003300:Copper; D012825:Silicon