title: A simple method for fabricating microwire tetrode with sufficient rigidity and integrity without a heat-fusing process.
abstract: Heat-fusing is a common process for fabricating microwire tetrodes. However, it is time-consuming, and the high-temperature treatment can easily cause the insulation of the microwire to overheat leading to short circuits. We herein provide a simple, fast method to fabricate microwire tetrodes without the heat-fusion process. By increasing the twisting density, we were able to fabricate tetrodes with good rigidity and integrity. This kind of tetrode showed good recording quality, penetrated the brain surface easily, and remained intact after chronic implantation. This method requires only general laboratory tools and is relatively simple even for inexperienced workers.
authors.affiliation: Department of Life Science and Institute of Zoology, National Taiwan University, Taipei, Taiwan.
authors.forename: Yi-Fang
authors.initials: YF
authors.lastname: Liao
authors.forename: Meng-Li
authors.initials: ML
authors.lastname: Tsai
authors.forename: Chen-Tung
authors.initials: CT
authors.lastname: Yen
authors.forename: Chiung-Hsiang
authors.initials: CH
authors.lastname: Cheng
mesh_terms: D000818:Animals; D001921:Brain / Q000502:physiology*; D004567:Electrodes, Implanted; D004594:Electrophysiology / Q000295:instrumentation* / Q000379:methods; D006358:Hot Temperature / Q000009:adverse effects; D008839:Microelectrodes; D051381:Rats; D020318:Rats, Long-Evans; D013997:Time Factors