title: Stick-slip substructure in rapid tape peeling.
abstract: The peeling of adhesive tape is known to proceed with a stick-slip mechanism and produces a characteristic ripping sound. The peeling also produces light and when peeled in a vacuum, even X-rays have been observed, whose emissions are correlated with the slip events. Here we present direct imaging of the detachment zone when Scotch tape is peeled off at high speed from a solid surface, revealing a highly regular substructure, during the slip phase. The typical 4-mm-long slip region has a regular substructure of transverse 220 μm wide slip bands, which fracture sideways at speeds over 300 m/s. The fracture tip emits waves into the detached section of the tape at ∼ 100 m/s, which promotes the sound, so characteristic of this phenomenon.
authors.affiliation: Division of Physical Sciences and Engineering, King Abdullah University of Science and Technology, Thuwal 23955-6900, Saudi Arabia.
authors.forename: S T
authors.initials: ST
authors.lastname: Thoroddsen
authors.forename: H D
authors.initials: HD
authors.lastname: Nguyen
authors.forename: K
authors.initials: K
authors.lastname: Takehara
authors.forename: T G
authors.initials: TG
authors.lastname: Etoh