title: Copper(I)-containing ionic liquids for high-rate electrodeposition.
abstract: New metal-containing ionic liquids [Cu(CH(3)CN)(n)][Tf(2)N] (n=2, 4; Tf(2)N=bis(trifluoromethylsulfonyl)- amide) have been synthesised and used as a non-aqueous electrolyte for the electrodeposition of copper at current densities greater than 25 A dm(-2). The tetrahedral copper(I)-containing cation in [Cu(CH(3)CN)(4)][Tf(2)N] is structurally analogous to quaternary ammonium and phosphonium ionic liquids and overcomes problems of metal solubility and mass transport. Two CH(3)CN ligands are removed at elevated temperatures to give [Cu(CH(3)CN)(2)][Tf(2)N], which can be used as a concentrated non-aqueous electrolyte. The structural and electrochemical characterisation of these compounds is described herein.
authors.affiliation: Katholieke Universiteit Leuven, Department of Chemistry, Celestijnenlaan 200F, P.O. Box 2404, 3001 Heverlee, Belgium. Neil.Brooks@chem.kuleuven.be
authors.forename: Neil R
authors.initials: NR
authors.lastname: Brooks
authors.forename: Stijn
authors.initials: S
authors.lastname: Schaltin
authors.forename: Kristof
authors.initials: K
authors.lastname: Van Hecke
authors.forename: Luc
authors.initials: L
authors.lastname: Van Meervelt
authors.forename: Koen
authors.initials: K
authors.lastname: Binnemans
authors.forename: Jan
authors.initials: J
authors.lastname: Fransaer