title: Direct patterning of copper on polyimide by site-selective surface modification via a screen-printing process.
abstract: We demonstrate a simple route to fabricating copper circuit patterns on the surface of polyimide film. The copper pattern can be obtained in three steps: 1) Formation of partially potassium hydroxide modified pattern via a screen-printing process, 2) formation of macromolecular metal complex with copper, and 3) copper metallization by DMAB reduction. The morphologies of these copper patterns are determined by cross-sectional transmission electronic microscopy (TEM), scanning electronic microscopy (SEM), and atomic force microscopy (AFM). Furthermore, the growing process of the metallic copper film is investigated. The direct patterning of copper patterns onto polyimide substrates is promising for use in electronics industry as a large-area and low-cost processing technique.
authors: College of Chemistry and Life Science, Guangxi Teachers Education University, Nanning, China. aaasuwei@yahoo.com.cn
authors: Wei
authors: W
authors: Su
authors: Peiyuan
authors: P
authors: Li
authors: Libei
authors: L
authors: Yao
authors: Fang
authors: F
authors: Yang
authors: Lifang
authors: L
authors: Liang
authors: Juan
authors: J
authors: Chen
mesh_terms: D003300:Copper / Q000737:chemistry*; D018625:Microscopy, Atomic Force; D053758:Nanoparticles / Q000737:chemistry; D012117:Resins, Synthetic / Q000737:chemistry*; D013499:Surface Properties
chemical_list: D012117:Resins, Synthetic; C029945:polyimide resin; D003300:Copper