title: Does a reduction of polymerization time and bonding steps affect the bond strength of brackets?
abstract: High bond strengths are required in order to avoid bracket failure during treatment while brackets should be removable. In addition, chair time should be kept at a minimum. Therefore, the aim of this study was to investigate any differences in bracket's bond strength to enamel by reducing the polymerization time and the steps of bonding procedure. Five hundred teeth were randomly allocated into 20 groups. The groups were established considering the investigated curing units (quartz-tungsten-halogen (QTH) and light-emitting diode (LED), each with two different polymerization times) and the used bonding agents (Clearfil SE Bond, Transbond Plus, Ideal1, iBond, and Transbond XT Primer following acid etching). The brackets were debonded using a shear-peel load and used to calculate the bond strength. The location of adhesive failure was registered by using the modified adhesive remnant index (ARI). The influence of the parameters curing unit, curing time, and bonding agent as well as their interaction products on bond strength showed that the bonding agent influenced the bond strength most followed by curing time. The parameter curing unit as well as all the generated interaction products of it showed a lower impact. Regarding the ARI, the bonding agent exhibited also the highest influence. Using a LED resulted in comparable bond strengths as the QTH curing device also at shorter exposure times. Additionally, the two-component self-etching primers showed similar bond strengths compared to the acid-etching method. Chair time can be reduced by using two-component self-etching primers and LED without decrease of bond strength.
authors: Department of Prosthodontics, LMU-University Munich, Munich, Germany.
authors: Timea
authors: T
authors: Lamper
authors: Stefanie
authors: S
authors: Steinhäuser-Andresen
authors: Karin C
authors: KC
authors: Huth
authors: Nicoleta
authors: N
authors: Ilie
authors: Ekaterini
authors: E
authors: Paschos
mesh_terms: D000134:Acid Etching, Dental / Q000379:methods; D000268:Adhesiveness; D003188:Composite Resins / Q000737:chemistry; D055117:Curing Lights, Dental / Q000145:classification; D003722:Dental Alloys / Q000737:chemistry; D003743:Dental Enamel / Q000648:ultrastructure; D003799:Dental Stress Analysis / Q000295:instrumentation; D006801:Humans; D055115:Light-Curing of Dental Adhesives / Q000379:methods*; D008422:Materials Testing; D008689:Methacrylates / Q000737:chemistry; D016910:Orthodontic Brackets; D010756:Phosphoric Acids / Q000737:chemistry; D058105:Polymerization; D019279:Resin Cements / Q000737:chemistry*; D033081:Shear Strength; D013193:Stainless Steel / Q000737:chemistry; D013314:Stress, Mechanical; D013499:Surface Properties; D013997:Time Factors
chemical_list: C438313:Clearfil SE Bond; D003188:Composite Resins; D003722:Dental Alloys; C103360:High-Q-Bond; D008689:Methacrylates; D010756:Phosphoric Acids; D019279:Resin Cements; C429625:Transbond Plus Self-Etching Primer; C516047:Transbond XT Light Cure Adhesive Primer; C477386:iBond; D013193:Stainless Steel; C030242:phosphoric acid