title: New prototype assembly methods for biosensor integrated circuits.
abstract: Two new prototype assembly methods have been evaluated for biosensors that combine an integrated circuit (IC) sensor with a culture chamber. The first method uses a poly-ethylene glycol (PEG) mould to mask the IC sensor during application of a room temperature vulcanising (RTV) silicone elastomer used to insulate the bondpads and bondwires. The second method utilises the 'partial encapsulation' service offered by Quik-Pak, USA. Both methods were shown to provide good electrical insulation and demonstrated biocompatibility with the NG108-15 cell line. These methods are particularly useful for the assembly of low-cost ICs with a small (< 4 mm²) sensor area.
authors.affiliation: Department of Electronic & Electrical Engineering, University of Bath, Bath BA27AY, UK. abmahdg@bath.ac.uk
authors.forename: Anthony H D
authors.initials: AH
authors.lastname: Graham
authors.forename: Chris R
authors.initials: CR
authors.lastname: Bowen
authors.forename: Susan M
authors.initials: SM
authors.lastname: Surguy
authors.forename: Jon
authors.initials: J
authors.lastname: Robbins
authors.forename: John
authors.initials: J
authors.lastname: Taylor
mesh_terms: D000818:Animals; D015374:Biosensing Techniques / Q000295:instrumentation*; D002460:Cell Line; D004566:Electrodes; D056656:Lab-On-A-Chip Devices; D008422:Materials Testing; D011092:Polyethylene Glycols
chemical_list: D011092:Polyethylene Glycols