title: Mold design rules for residual layer-free patterning in thermal imprint lithography.
abstract: We present the mold design rules for assuring residual layer-free patterning in thermal imprint processes. Using simple relations for mass balance, structural stability, and work of adhesion, we derive the conditions with respect to the given single or multigeometrical feature of the mold, which are compared with simple thermal imprint experiments using soft imprint molds. Our analysis could serve as a guideline for designing the optimum mold geometry and selecting mold material in residual layer-free thermal imprint processes.
authors: National Creative Research Initiative Center for Intelligent Hybrids, School of Chemical and Biological Engineering, The WCU Program of Chemical Convergence for Energy and Environment, The WCU Program on Multiscale Mechanical Design, Seoul National University, Seoul, 151-744, Korea.
authors: Hyunsik
authors: H
authors: Yoon
authors: Sung Hoon
authors: SH
authors: Lee
authors: Seung Hyun
authors: SH
authors: Sung
authors: Kahp Y
authors: KY
authors: Suh
authors: Kookheon
authors: K
authors: Char