title: Whole Field Strain Measurement on Complex Surfaces by Digital Speckle Pattern Interferometry.
abstract: Digital Speckle Pattern Interferometry (DSPI), originally known as electronic speckle pattern interferometry (ESPI), is an interferometry based method applicable for conducting 3-dimensional whole field strain characterization. The present DSPI systems are suited for analyzing a relatively simple surface (e.g., a plane surface). However, few existing systems are able to accurately determine strain distributions on a surface with significant contour complexity. Here, we present development of a novel DSPI system that allows strain characterization of a sample with a complex surface. In the described DSPI system, deformations and contours as well as an absolute phase value are determined. Furthermore, variations in measurement sensitivity are considered. We describe a principle and methodology using two examples in the area of mechanical engineering and biomedical engineering, and discuss potential usages and future directions.
authors.affiliation: Department of Mechanical Engineering, Oakland University, Rochester, MI 48309, USA.
authors.forename: Yanghong
authors.initials: Y
authors.lastname: Wang
authors.forename: Dan
authors.initials: D
authors.lastname: Thomas
authors.forename: Ping
authors.initials: P
authors.lastname: Zhang
authors.forename: Hiroki
authors.initials: H
authors.lastname: Yokota
authors.forename: Lianxiang
authors.initials: L
authors.lastname: Yang