title: Carbon-nanotube through-silicon via interconnects for three-dimensional integration.
abstract: Interconnection of carbon-nanotube (CNT)-filled through-silicon vias is demonstrated through an easy-to-implement process based on mechanical fastening. Direct CNT-to-CNT and CNT-to-Au contacts are realized at the microscale, and their specific contact resistances extracted from electrical measurements are approximately 1.2 × 10(-3) Ω cm(2) and 4.5 × 10(-4) Ω cm(2) , respectively.
authors.affiliation: Department of Microtechnology and Nanoscience (MC2) Chalmers University of Technology 412 96 Göteborg, Sweden.
authors.forename: Teng
authors.initials: T
authors.lastname: Wang
authors.forename: Kejll
authors.initials: K
authors.lastname: Jeppson
authors.forename: Lilei
authors.initials: L
authors.lastname: Ye
authors.forename: Johan
authors.initials: J
authors.lastname: Liu