title: Droplet impingement dynamics: effect of surface temperature during boiling and non-boiling conditions.
abstract: This study investigates the hydrodynamic characteristics of droplet impingement on heated surfaces and compares the effect of surface temperature when using water and a nanofluid on a polished and nanostructured surface. Results are obtained for an impact Reynolds number and Weber number of approximately 1700 and 25, respectively. Three discs are used: polished silicon, nanostructured porous silicon and gold-coated polished silicon. Seven surface temperatures, including single-phase (non-boiling) and two-phase (boiling) conditions, are included. Droplet impact velocity, transient spreading diameter and dynamic contact angle are measured. Results of water and a water-based single-wall carbon-nanotube nanofluid impinging on a polished silicon surface are compared to determine the effects of nanoparticles on impinging dynamics. The nanofluid results in larger spreading velocities, larger spreading diameters and an increase in early-stage dynamic contact angle. Results of water impinging on both polished silicon and nanostructured silicon show that the nanostructured surface enhances the heat transfer for evaporative cooling at lower surface temperatures, which is indicated by a shorter evaporation time. Using a nanofluid or a nanostructured surface can reduce the total evaporation time up to 20% and 37%, respectively. Experimental data are compared with models that predict dynamic contact angle and non-dimensional maximum spreading diameter. Results show that the molecular-kinetic theory's dynamic contact angle model agrees well with current experimental data for later times, but over-predicts at early times. Predictions of maximum spreading diameter based on surface energy analyses indicate that these models over-predict unless empirical coefficients are adjusted to fit the test conditions. This is a consequence of underestimates of the dissipative energy for the conditions studied.
authors.affiliation: Mechanical Engineering, Oregon State University, Corvallis, OR 97331-6001, USA.
authors.forename: Jian
authors.initials: J
authors.lastname: Shen
authors.forename: James A
authors.initials: JA
authors.lastname: Liburdy
authors.forename: Deborah V
authors.initials: DV
authors.lastname: Pence
authors.forename: Vinod
authors.initials: V
authors.lastname: Narayanan