title: Scalable manufacturing of plasmonic nanodisk dimers and cusp nanostructures using salting-out quenching method and colloidal lithography.
abstract: Localization of large electric fields in plasmonic nanostructures enables various processes such as single-molecule detection, higher harmonic light generation, and control of molecular fluorescence and absorption. High-throughput, simple nanofabrication techniques are essential for implementing plasmonic nanostructures with large electric fields for practical applications. In this article we demonstrate a scalable, rapid, and inexpensive fabrication method based on the salting-out quenching technique and colloidal lithography for the fabrication of two types of nanostructures with large electric field: nanodisk dimers and cusp nanostructures. Our technique relies on fabricating polystyrene doublets from single beads by controlled aggregation and later using them as soft masks to fabricate metal nanodisk dimers and nanocusp structures. Both of these structures have a well-defined geometry for the localization of large electric fields comparable to structures fabricated by conventional nanofabrication techniques. We also show that various parameters in the fabrication process can be adjusted to tune the geometry of the final structures and control their plasmonic properties. With advantages in throughput, cost, and geometric tunability, our fabrication method can be valuable in many applications that require plasmonic nanostructures with large electric fields.
authors.affiliation: Department of Engineering Science and Mechanics, The Pennsylvania State University, University Park, Pennsylvania 16802-6812, USA.
authors.forename: Bala Krishna
authors.initials: BK
authors.lastname: Juluri
authors.forename: Neetu
authors.initials: N
authors.lastname: Chaturvedi
authors.forename: Qingzhen
authors.initials: Q
authors.lastname: Hao
authors.forename: Mengqian
authors.initials: M
authors.lastname: Lu
authors.forename: Darrell
authors.initials: D
authors.lastname: Velegol
authors.forename: Lasse
authors.initials: L
authors.lastname: Jensen
authors.forename: Tony Jun
authors.initials: TJ
authors.lastname: Huang