title: Retreatment of silicon slurry by membrane processes.
abstract: The purpose of the present study is to develop a process to regenerate the polish liquid used in Chemical and Mechanical Polishing (CMP), called "slurry", and more specifically Silicon CMP slurry. Physico-chemical analyses show a considerable dilution of slurry through washing waters used in polishing. Thus, this effluent has been characterised for a better identification of the deviations from the slurry of reference (Point Of Use). Hence, the principle is to regenerate this effluent by membrane processes. The ultrafiltration results obtained at laboratory scale have led to the development of an industrial prototype. An optimal utilisation of this treatment allows completing a two-step process: the reconcentration by ultrafiltration and a chemical adjustment by addition of concentrated slurry. A stable behaviour of the slurry at the different steps of the process has been observed. Polishing results are similar with retreated and POU slurries. Furthermore, the functioning at industrial scale permits to maintain the performances obtained on the laboratory pilot.
authors: Université Paul Cézanne Aix Marseille, Laboratoire de Mécanique, Modélisation et Procédés Propres (M2P2 - UMR-CNRS 6181), Europôle de l'Arbois, BP. 80, Bâtiment Laennec, Hall C, 13545 Aix en Provence Cedex 04, France; KEMESYS, 125 ZA Verdalai, 13790 Peynier, France.
authors: F
authors: F
authors: Testa
authors: C
authors: C
authors: Coetsier
authors: E
authors: E
authors: Carretier
authors: M
authors: M
authors: Ennahali
authors: B
authors: B
authors: Laborie
authors: C
authors: C
authors: Serafino
authors: F
authors: F
authors: Bulgarelli
authors: P
authors: P
authors: Moulin
mesh_terms: D008567:Membranes, Artificial; D012825:Silicon / Q000737:chemistry*
chemical_list: D008567:Membranes, Artificial; D012825:Silicon