title: Effects of colloidal nanosilica on the rheological properties of epoxy resins filled with organoclay.
abstract: The rheological properties of epoxy resins filled with organoclay and colloidal nanosilica were investigated by employing a parallel plate rheometer in flow mode at 25 degrees C. Shear thickening and shear thinning behaviors were observed in the epoxy resins filled with a mixture of organoclay and colloidal nanosilica. Minima were observed in the relaxation time of the systems consisting of epoxy resins filled with organoclay and colloidal silica as the content of colloidal nanosilica was increased. It seems that the colloidal nanosilica increased the mobility of the filled epoxy resins and reduced the interactions between the silicate layers in the systems.
authors.affiliation: Division of Semiconductors and Chemical Engineering, Chonbuk National University, Jeonju 561-756, Korea.
authors.forename: Dinh Huong
authors.initials: DH
authors.lastname: Nguyen
authors.forename: Gwang Seok
authors.initials: GS
authors.lastname: Song
authors.forename: Dai Soo
authors.initials: DS
authors.lastname: Lee