title: Fabrication of nano-scale Cu bond pads with seal design in 3D integration applications.
abstract: A method to fabricate nano-scale Cu bond pads for improving bonding quality in 3D integration applications is reported. The effect of Cu bonding quality on inter-level via structural reliability for 3D integration applications is investigated. We developed a Cu nano-scale-height bond pad structure and fabrication process for improved bonding quality by recessing oxides using a combination of SiO2 CMP process and dilute HF wet etching. In addition, in order to achieve improved wafer-level bonding, we introduced a seal design concept that prevents corrosion and provides extra mechanical support. Demonstrations of these concepts and processes provide the feasibility of reliable nano-scale 3D integration applications.
authors.affiliation: National Chiao Tung University, Hsinchu 300, Taiwan.
authors.forename: K N
authors.initials: KN
authors.lastname: Chen
authors.forename: C K
authors.initials: CK
authors.lastname: Tsang
authors.forename: W W
authors.initials: WW
authors.lastname: Wu
authors.forename: S H
authors.initials: SH
authors.lastname: Lee
authors.forename: J Q
authors.initials: JQ
authors.lastname: Lu
mesh_terms: D003300:Copper / Q000737:chemistry*; D046911:Macromolecular Substances / Q000737:chemistry; D008422:Materials Testing; D008968:Molecular Conformation; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure*; D010316:Particle Size; D013499:Surface Properties; D018511:Systems Integration
chemical_list: D046911:Macromolecular Substances; D003300:Copper