title: Photo-cross-linking-assisted thermal stability of DNA origami structures and its application for higher-temperature self-assembly.
abstract: Heat tolerance of DNA origami structures has been improved about 30 °C by photo-cross-linking of 8-methoxypsoralen. To demonstrate one of its applications, the cross-linked origami were used for higher-temperature self-assembly, which markedly increased the yield of the assembled product when compared to the self-assembly of non-cross-linked origami at lower-temperature. By contrast, at higher-temperature annealing, native non-cross-linked tiles did not self-assemble to yield the desired product; however, they formed a nonspecific broken structure.
authors.affiliation: Department of Chemistry, Graduate School of Science, Kyoto University, Kitashirakawa-oiwakecho, Sakyo-ku, Kyoto 606-8502, Japan.
authors.forename: Arivazhagan
authors.initials: A
authors.lastname: Rajendran
authors.forename: Masayuki
authors.initials: M
authors.lastname: Endo
authors.forename: Yousuke
authors.initials: Y
authors.lastname: Katsuda
authors.forename: Kumi
authors.initials: K
authors.lastname: Hidaka
authors.forename: Hiroshi
authors.initials: H
authors.lastname: Sugiyama
mesh_terms: D003432:Cross-Linking Reagents / Q000737:chemistry*; D004247:DNA / Q000737:chemistry*; D006358:Hot Temperature; D008730:Methoxsalen / Q000737:chemistry*; D009690:Nucleic Acid Conformation; D055668:Photochemical Processes
chemical_list: D003432:Cross-Linking Reagents; D004247:DNA; D008730:Methoxsalen