title: Ultra-long metal nanowire arrays on solid substrate with strong bonding.
abstract: Ultra-long metal nanowire arrays with large circular area up to 25 mm in diameter were obtained by direct electrodeposition on metalized Si and glass substrates via a template-based method. Nanowires with uniform length up to 30 μm were obtained. Combining this deposition process with lithography technology, micrometre-sized patterned metal nanowire array pads were successfully fabricated on a glass substrate. Good adhesion between the patterned nanowire array pads and the substrate was confirmed using scanning acoustic microscopy characterization. A pull-off tensile test showed strong bonding between the nanowires and the substrate. Conducting atomic force microscopy (C-AFM) measurements showed that approximately 95% of the nanowires were electrically connected with the substrate, demonstrating its viability to use as high-density interconnect.
authors: Tyndall National Institute, University College Cork, Cork, Lee Maltings, Dyke Parade, Cork, Ireland. kafil.mahmood@tyndall.ie.
authors: Ju
authors: J
authors: Xu
authors: Lan
authors: L
authors: Chen
authors: Alan
authors: A
authors: Mathewson
authors: Kafil M
authors: KM
authors: Razeeb