title: Si-photonics based passive device packaging and module performance.
abstract: We report a fully packaged silicon passive waveguide device designed for a tunable filter based on a ring-resonator. Polarization diversity circuits prevent polarization dependant issues in the silicon ring-resonator. For the device packaging, the YAG laser welding technique has been used for pigtailing both of the input and output fibers. Post welding misalignment was compensated by mechanical fine tuning using the seesaw effect via power monitoring. Packaging loss less than 1.5 dB with respect to chip measurement has been achieved using 10 µm-curvature radius lensed fibers. In addition, the packaging process and the module performance are presented.
authors.affiliation: Institute of Microelectronics, A*STAR (Agency for Science, Technology and Research), Singapore. jeonghwan.song@gmail.com
authors.forename: Jeong Hwan
authors.initials: JH
authors.lastname: Song
authors.forename: Jing
authors.initials: J
authors.lastname: Zhang
authors.forename: Huijuan
authors.initials: H
authors.lastname: Zhang
authors.forename: Chao
authors.initials: C
authors.lastname: Li
authors.forename: Guo Qiang
authors.initials: GQ
authors.lastname: Lo