title: Thick-film acoustic emission sensors for use in structurally integrated condition-monitoring applications.
abstract: Monitoring the condition of complex engineering structures is an important aspect of modern engineering, eliminating unnecessary work and enabling planned maintenance, preventing failure. Acoustic emissions (AE) testing is one method of implementing continuous nondestructive structural health monitoring. A novel thick-film (17.6 μm) AE sensor is presented. Lead zirconate titanate thick films were fabricated using a powder/sol composite ink deposition technique and mechanically patterned to form a discrete thick-film piezoelectric AE sensor. The thick-film sensor was benchmarked against a commercial AE device and was found to exhibit comparable responses to simulated acoustic emissions.
authors.affiliation: Cranfield University, Cranfield, Bedfordshire, UK.
authors.forename: Andrew J
authors.initials: AJ
authors.lastname: Pickwell
authors.forename: Robert A
authors.initials: RA
authors.lastname: Dorey
authors.forename: David
authors.initials: D
authors.lastname: Mba