title: Freestanding ultrananocrystalline diamond films with homojunction insulating layer on conducting layer and their high electron field emission properties.
abstract: Freestanding ultrananocrystalline diamond (UNCD) films with homojunction insulating layer in situ grown on a conducting layer showed superior electron field emission (EFE) properties. The insulating layer of the films contains large dendrite type grains (400-600 nm in size), whereas the conducting layer contains nanosize equi-axed grains (5-20 nm in size) separated by grain boundaries of about 0.5-1 nm in width. The conducting layer possesses n-type (or semimetallic) conductivity of about 5.6 × 10(-3) (Ω cm)(-1), with sheet carrier concentration of about 1.4 × 10(12) cm(-2), which is ascribed to in situ doping of Li-species from LiNbO(3) substrates during growth of the films. The conducting layer intimately contacts the bottom electrodes (Cu-foil) by without forming the Schottky barrier, form homojunction with the insulating layer that facilitates injection of electrons into conduction band of diamond, and readily field emitted at low applied field. The EFE of freestanding UNCD films could be turned on at a low field of E(0) = 10.0 V/μm, attaining EFE current density of 0.2 mA/cm(2) at an applied field of 18.0 V/μm, which is superior to the EFE properties of UNCD films grown on Si substrates with the same chemical vapor deposition (CVD) process. Such an observation reveals the importance in the formation of homojunction on enhancing the EFE properties of materials. The large grain granular structure of the freestanding UNCD films is more robust against harsh environment and shows high potential toward diamond based electronic applications.
authors.affiliation: Department of Physics, Tamkang University, Tamsui 251, Taiwan, ROC. peetijoseph@gmail.com
authors.forename: Joseph P
authors.initials: JP
authors.lastname: Thomas
authors.forename: Huang-Chin
authors.initials: HC
authors.lastname: Chen
authors.forename: Nyan-Hwa
authors.initials: NH
authors.lastname: Tai
authors.forename: I-Nan
authors.initials: IN
authors.lastname: Lin