title: Self-healing epoxy composite with heat-resistant healant.
abstract: To provide self-healing epoxy composite with adequate heat resistance for high-performance application, we developed a novel microencapsulated epoxy/mercaptan healing agent. The key measure lies in usage of diglycidyl ether of bisphenol A (EPON 828) as the polymerizable component and 2,4,6-tris(dimethylaminomethyl)phenol (DMP-30) as the catalyst. Because of the higher thermal stability of EPON 828 and lower volatility of DMP-30, the healing agent and the self-healing composite not only survive high-temperature curing and thermal exposure, but also offer satisfactory capability of autonomous properties restoration, as characterized by both fracture mechanics and fatigue tests. Especially when the operation temperature is not higher than 200 °C, the performance of the healing system is nearly independent of thermal history.
authors: College of Materials Science and Engineering, South China University of Technology, Guangzhou 510640, P. R. China.
authors: Yan Chao
authors: YC
authors: Yuan
authors: Xiao Ji
authors: XJ
authors: Ye
authors: Min Zhi
authors: MZ
authors: Rong
authors: Ming Qiu
authors: MQ
authors: Zhang
authors: Gui Cheng
authors: GC
authors: Yang
authors: Jian Qing
authors: JQ
authors: Zhao