title: A novel solution-stamping process for preparation of a highly conductive aluminum thin film.
abstract: A novel solution-stamping process for the preparation of a highly conductive aluminum thin film on both rigid and flexible substrates is proposed. The superior electrical properties of Al thin films fabricated by the solution-stamping process compared to silver and gold films fabricated from colloidal nanoparticles are experimentally demonstrated, and their applications in electronic circuits on rigid and flexible substrates and to organic light-emitting diodes (OLEDs) are investigated.
authors: Functional Materials Division, Korea Institute of Materials Science, Seongsan-gu, Changwon, Gyeongnam, Korea. hyelee@kims.re.kr
authors: Hye Moon
authors: HM
authors: Lee
authors: Si-Young
authors: SY
authors: Choi
authors: Kyung Tae
authors: KT
authors: Kim
authors: Jung-Yeul
authors: JY
authors: Yun
authors: Dae Soo
authors: DS
authors: Jung
authors: Seung Bin
authors: SB
authors: Park
authors: Jongwook
authors: J
authors: Park
mesh_terms: D000535:Aluminum / Q000737:chemistry*; D017610:Calcium Compounds / Q000737:chemistry; D004553:Electric Conductivity; D007281:Ink; D010087:Oxides / Q000737:chemistry; D011093:Polyethylene Terephthalates / Q000737:chemistry; D012972:Sodium Hydroxide / Q000737:chemistry; D012996:Solutions
chemical_list: D017610:Calcium Compounds; D010087:Oxides; D011093:Polyethylene Terephthalates; D012996:Solutions; C025539:Lavsan; C004569:soda lime; D012972:Sodium Hydroxide; D000535:Aluminum