title: Effect of gold wire bonding process on angular correlated color temperature uniformity of white light-emitting diode.
abstract: Gold wire bonding is an important packaging process of lighting emitting diode (LED). In this work, we studied the effect of gold wire bonding on the angular uniformity of correlated color temperature (CCT) in white LEDs whose phosphor layers were coated by freely dispersed coating process. Experimental study indicated that different gold wire bonding impacts the geometry of phosphor layer, and it results in different fluctuation trends of angular CCT at different spatial planes in one LED sample. It also results in various fluctuating amplitudes of angular CCT distributions at the same spatial plane for samples with different wire bonding angles. The gold wire bonding process has important impact on angular uniformity of CCT in LED package.
authors: Division of MoEMS, Wuhan National Laboratory for Optoelectronics, Wuhan, 430074, China.
authors: Bulong
authors: B
authors: Wu
authors: Xiaobing
authors: X
authors: Luo
authors: Huai
authors: H
authors: Zheng
authors: Sheng
authors: S
authors: Liu
mesh_terms: D004559:Electric Wiring; D004867:Equipment Design; D019544:Equipment Failure Analysis; D006046:Gold / Q000737:chemistry*; D006358:Hot Temperature; D008029:Lighting / Q000295:instrumentation*; D012666:Semiconductors
chemical_list: D006046:Gold