title: Ultra-high density packaging technology for injectable medical devices.
abstract: Future implantable medical devices will be highly miniaturized and almost certainly leverage die-level electronics miniaturization and packaging. Here, an integrated ultra-high density packaging platform is proposed to enable a new class of medical devices. Dense modules are obtained by interconnecting existing ASICs and discrete components using a process which achieves the highest packaging densities available.
authors.affiliation: Charles Stark Draper Laboratory, Cambridge, MA 02139, USA.
authors.forename: Bryan L
authors.initials: BL
authors.lastname: McLaughlin
authors.forename: Brian
authors.initials: B
authors.lastname: Smith
authors.forename: John
authors.initials: J
authors.lastname: Lachapelle
authors.forename: Dan
authors.initials: D
authors.lastname: Traviglia
authors.forename: T S
authors.initials: TS
authors.lastname: Sriram
authors.forename: David
authors.initials: D
authors.lastname: O'Dowd
mesh_terms: D004864:Equipment and Supplies; D008904:Miniaturization