title: A novel flex-rigid and soft-release ECoG array.
abstract: This article addresses a novel fabrication process for an electrocorticogram (ECoG) electrode array. It consists of three regions: a flexible recording area, a flexible cable, and a rigid field for soldering the connectors. The flexible components can adapt to the curved shape of the cerebral cortex. Furthermore, the entire structure is a free-standing membrane, attached by removable polyimide straps to its carrier substrate. This configuration allows for a high level of control during soldering, electrode characterization and sterilization, as well as a soft release of the array off its carrier just before implantation. The array contains 128 gold electrodes, each 300 nm thick, sandwiched between two 5 μm thick polyimide films. The measuring area of the device is a regular hexagon with a side length of 7.2 mm, designed for implantation on the primary visual cortex of a Rhesus monkey. The flexible cable is 4 cm long. The rigid soldering area was designed for 4 × 32 OMNETICS connectors. The line resistance from an electrode site to the corresponding electrical connector pin is 540 Ω.
authors.affiliation: IMSAS Institute, University of Bremen, 28359 Bremen, Germany. et@imsas.uni-bremen.de
authors.forename: E
authors.initials: E
authors.lastname: Tolstosheeva
authors.forename: V
authors.initials: V
authors.lastname: Gordillo-González
authors.forename: T
authors.initials: T
authors.lastname: Hertzberg
authors.forename: L
authors.initials: L
authors.lastname: Kempen
authors.forename: I
authors.initials: I
authors.lastname: Michels
authors.forename: A
authors.initials: A
authors.lastname: Kreiter
authors.forename: W
authors.initials: W
authors.lastname: Lang
mesh_terms: D004566:Electrodes; D004569:Electroencephalography / Q000379:methods*