title: Ultra-Thin Chip Package (UTCP) and stretchable circuit technologies for wearable ECG system.
abstract: A comfortable, wearable wireless ECG monitoring system is proposed. The device is realized using the combination of two proprietary advanced technologies for electronic packaging and interconnection : the UTCP (Ultra-Thin Chip Package) technology and the SMI (Stretchable Mould Interconnect) technology for elastic and stretchable circuits. Introduction of these technologies results in small fully functional devices, exhibiting a significant increase in user comfort compared to devices fabricated with more conventional packaging and interconnection technologies.
authors.affiliation: Center for Microsystems Technology, IMEC and Ghent University, Gent-Zwijnaarde B-9052, Belgium. Tom.Sterken@UGent.be
authors.forename: Tom
authors.initials: T
authors.lastname: Sterken
authors.forename: Jan
authors.initials: J
authors.lastname: Vanfleteren
authors.forename: Tom
authors.initials: T
authors.lastname: Torfs
authors.forename: Maaike Op
authors.initials: MO
authors.lastname: de Beeck
authors.forename: Frederick
authors.initials: F
authors.lastname: Bossuyt
authors.forename: Chris
authors.initials: C
authors.lastname: Van Hoof
mesh_terms: D003020:Clothing; D004553:Electric Conductivity; D004562:Electrocardiography / Q000295:instrumentation* / Q000379:methods*; D015716:Electrocardiography, Ambulatory / Q000295:instrumentation / Q000379:methods; D004566:Electrodes; D004581:Electronics / Q000295:instrumentation; D004867:Equipment Design; D006801:Humans; D008904:Miniaturization; D008991:Monitoring, Physiologic / Q000295:instrumentation; D011108:Polymers / Q000737:chemistry; D012815:Signal Processing, Computer-Assisted; D012867:Skin / Q000473:pathology; D013686:Telemetry / Q000379:methods*
chemical_list: D011108:Polymers