title: A new twist on scanning thermal microscopy.
abstract: The thermal bimorph is a very popular thermal sensing mechanism used in various applications from meat thermometers to uncooled infrared cameras. While thermal bimorphs have remained promising for scanning thermal microscopy, unfortunately the bending of the bimorph directly interferes with the bending associated with topographical information. We circumvent this issue by creating bimorphs that twist instead of bending and demonstrate the superior properties of this approach as compared to conventional scanning thermal microscopy.
authors.affiliation: Materials and Manufacturing Directorate, Air Force Research Laboratory, WPAFB, Ohio 45433, USA. michael.mcconney@wpafb.af.mil
authors.forename: Michael E
authors.initials: ME
authors.lastname: McConney
authors.forename: Dhaval D
authors.initials: DD
authors.lastname: Kulkarni
authors.forename: Hao
authors.initials: H
authors.lastname: Jiang
authors.forename: Timothy J
authors.initials: TJ
authors.lastname: Bunning
authors.forename: Vladimir V
authors.initials: VV
authors.lastname: Tsukruk
mesh_terms: D000497:Alloys / Q000737:chemistry*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D007089:Image Enhancement / Q000295:instrumentation* / Q000379:methods; D008853:Microscopy / Q000295:instrumentation* / Q000379:methods; D049329:Nanostructures / Q000737:chemistry* / Q000648:ultrastructure; D036103:Nanotechnology / Q000295:instrumentation* / Q000379:methods; D013817:Thermography / Q000295:instrumentation* / Q000379:methods; D013821:Thermometers; D014159:Transducers
chemical_list: D000497:Alloys