title: Modeling Impact-induced Failure of Polysilicon MEMS: A Multi-scale Approach.
abstract: Failure of packaged polysilicon micro-electro-mechanical systems (MEMS) subjected to impacts involves phenomena occurring at several length-scales. In this paper we present a multi-scale finite element approach to properly allow for: (i) the propagation of stress waves inside the package; (ii) the dynamics of the whole MEMS; (iii) the spreading of micro-cracking in the failing part(s) of the sensor. Through Monte Carlo simulations, some effects of polysilicon micro-structure on the failure mode are elucidated.
authors.affiliation: Politecnico di Milano, Dipartimento di Ingegneria Strutturale, Piazza Leonardo da Vinci 32, 20133 - Milano, Italy.
authors.forename: Stefano
authors.initials: S
authors.lastname: Mariani
authors.forename: Aldo
authors.initials: A
authors.lastname: Ghisi
authors.forename: Alberto
authors.initials: A
authors.lastname: Corigliano
authors.forename: Sarah
authors.initials: S
authors.lastname: Zerbini