title: Thiourea leaching gold and silver from the printed circuit boards of waste mobile phones.
abstract: The present communication deals with the leaching of gold and silver from the printed circuit boards (PCBs) of waste mobile phones using an effective and less hazardous system, i.e., a thiourea leaching process as an alternative to the conventional and toxic cyanide leaching of gold. The influence of particle size, thiourea and Fe(3+) concentrations and temperature on the leaching of gold and silver from waste mobile phones was investigated. Gold extraction was found to be enhanced in a PCBs particle size of 100 mesh with the solutions containing 24 g/L thiourea and Fe(3+) concentration of 0.6% under the room temperature. In this case, about 90% of gold and 50% of silver were leached by the reaction of 2h. The obtained data will be useful for the development of processes for the recycling of gold and silver from the PCBs of waste mobile phones.
authors.affiliation: College of Environment and Safety Engineering, Qingdao University of Science & Technology, Qingdao, Shandong 266042, PR China. lijy741018@qust.edu.cn
authors.forename: Li
authors.initials: L
authors.lastname: Jing-ying
authors.forename: Xu
authors.initials: X
authors.lastname: Xiu-li
authors.forename: Liu
authors.initials: L
authors.lastname: Wen-quan
mesh_terms: D040421:Cell Phone; D059029:Electronic Waste; D006046:Gold / Q000302:isolation & purification*; D007501:Iron; D010316:Particle Size; D012834:Silver / Q000302:isolation & purification*; D013696:Temperature; D013890:Thiourea / Q000737:chemistry*; D018505:Waste Management / Q000379:methods*
chemical_list: D012834:Silver; D006046:Gold; D007501:Iron; D013890:Thiourea