title: 3-D integrated heterogeneous intra-chip free-space optical interconnect.
abstract: This paper presents the first chip-scale demonstration of an intra-chip free-space optical interconnect (FSOI) we recently proposed. This interconnect system provides point-to-point free-space optical links between any two communication nodes, and hence constructs an all-to-all intra-chip communication fabric, which can be extended for inter-chip communications as well. Unlike electrical and other waveguide-based optical interconnects, FSOI exhibits low latency, high energy efficiency, and large bandwidth density, and hence can significantly improve the performance of future many-core chips. In this paper, we evaluate the performance of the proposed FSOI interconnect, and compare it to a waveguide-based optical interconnect with wavelength division multiplexing (WDM). It shows that the FSOI system can achieve significantly lower loss and higher energy efficiency than the WDM system, even with optimistic assumptions for the latter. A 1×1-cm2 chip prototype is fabricated on a germanium substrate with integrated photodetectors. Commercial 850-nm GaAs vertical-cavity-surface-emitting-lasers (VCSELs) and fabricated fused silica microlenses are 3-D integrated on top of the substrate. At 1.4-cm distance, the measured optical transmission loss is 5 dB, the crosstalk is less than -20 dB, and the electrical-to-electrical bandwidth is 3.3 GHz. The latter is mainly limited by the 5-GHz VCSEL.
authors.affiliation: Department of Electrical and Computer Engineering, University of Rochester, Rochester, New York 14627, USA.
authors.forename: Berkehan
authors.initials: B
authors.lastname: Ciftcioglu
authors.forename: Rebecca
authors.initials: R
authors.lastname: Berman
authors.forename: Shang
authors.initials: S
authors.lastname: Wang
authors.forename: Jianyun
authors.initials: J
authors.lastname: Hu
authors.forename: Ioannis
authors.initials: I
authors.lastname: Savidis
authors.forename: Manish
authors.initials: M
authors.lastname: Jain
authors.forename: Duncan
authors.initials: D
authors.lastname: Moore
authors.forename: Michael
authors.initials: M
authors.lastname: Huang
authors.forename: Eby G
authors.initials: EG
authors.lastname: Friedman
authors.forename: Gary
authors.initials: G
authors.lastname: Wicks
authors.forename: Hui
authors.initials: H
authors.lastname: Wu