title: Applications of multi-walled carbon nanotube in electronic packaging.
abstract: Thermal management of integrated circuit chip is an increasing important challenge faced today. Heat dissipation of the chip is generally achieved through the die attach material and solders. With the temperature gradients in these materials, high thermo-mechanical stress will be developed in them, and thus they must also be mechanically strong so as to provide a good mechanical support to the chip. The use of multi-walled carbon nanotube to enhance the thermal conductivity, and the mechanical strength of die attach epoxy and Pb-free solder is demonstrated in this work.
authors.affiliation: School of Electrical and Electronic Engineering, Nanyang Technological University, Jurong, 639798, Singapore. ecmtan@ntu.edu.sg.
authors.forename: Cher Ming
authors.initials: CM
authors.lastname: Tan
authors.forename: Charles
authors.initials: C
authors.lastname: Baudot
authors.forename: Yongdian
authors.initials: Y
authors.lastname: Han
authors.forename: Hongyang
authors.initials: H
authors.lastname: Jing