title: The model of nano-scale copper particle removal from silicon surface in high pressure CO2 + H2O and CO2 + H2O + IPA cleaning solutions.
abstract: This study focuses on the description of the static forces in CO2-H2O and CO2-H2O-IPA cleaning solutions with a separate fluid phase entrapped between nano-scale copper particles and a silicon surface. Calculations demonstrate that increasing the pressure of the cleaning system decreases net adhesion force (NAF) between the particle and silicon. The NAF of a particle for in CO2-H2O-IPA system is less than that in CO2-H2O system, suggesting that the particles enter into bulk layer more easily as the CO2-H2O cleaning system is added IPA.
authors.affiliation: Department of Chemistry, Renmin University of China, Beijing 100872, China.
authors.forename: Xin
authors.initials: X
authors.lastname: Tan
authors.forename: Jiajue
authors.initials: J
authors.lastname: Chai
authors.forename: Xiaogang
authors.initials: X
authors.lastname: Zhang
authors.forename: Jiawei
authors.initials: J
authors.lastname: Chen