title: Chip-to-chip optical interconnections between stacked self-aligned SOI photonic chips.
abstract: Photonic silicon devices are key enabling technologies for next generation High Performance Computers. In this paper, we report the possibility to stack and optically interconnect SOI based photonic chips for future System-In-Package photonic architecture. Combining vertical grating couplers and state-of-the-art flip-chip technology, we demonstrated low loss penalties and wide spectral range optical interconnections between stacked photonic chips.
authors.affiliation: CEA-LETI, MINATEC Campus, 17 rue des Martyrs, 38054 Grenoble, France. stephane.bernabe@cea.fr
authors.forename: Stéphane
authors.initials: S
authors.lastname: Bernabé
authors.forename: Christophe
authors.initials: C
authors.lastname: Kopp
authors.forename: Marion
authors.initials: M
authors.lastname: Volpert
authors.forename: Julie
authors.initials: J
authors.lastname: Harduin
authors.forename: Jean-Marc
authors.initials: JM
authors.lastname: Fédéli
authors.forename: Hervé
authors.initials: H
authors.lastname: Ribot
mesh_terms: D004867:Equipment Design; D019544:Equipment Failure Analysis; D055096:Optical Devices; D012031:Refractometry / Q000295:instrumentation*; D012815:Signal Processing, Computer-Assisted / Q000295:instrumentation*; D012825:Silicon / Q000737:chemistry*; D020349:Surface Plasmon Resonance / Q000295:instrumentation*
chemical_list: D012825:Silicon