title: Parallel- and serial-contact electrochemical metallization of monolayer nanopatterns: A versatile synthetic tool en route to bottom-up assembly of electric nanocircuits.
abstract: Contact electrochemical transfer of silver from a metal-film stamp (parallel process) or a metal-coated scanning probe (serial process) is demonstrated to allow site-selective metallization of monolayer template patterns of any desired shape and size created by constructive nanolithography. The precise nanoscale control of metal delivery to predefined surface sites, achieved as a result of the selective affinity of the monolayer template for electrochemically generated metal ions, provides a versatile synthetic tool en route to the bottom-up assembly of electric nanocircuits. These findings offer direct experimental support to the view that, in electrochemical metal deposition, charge is carried across the electrode-solution interface by ion migration to the electrode rather than by electron transfer to hydrated ions in solution.
authors.affiliation: Department of Materials and Interfaces, The Weizmann Institute of Science, Rehovot 76100, Israel.
authors.forename: Jonathan
authors.initials: J
authors.lastname: Berson
authors.affiliation: Department of Materials and Interfaces, The Weizmann Institute of Science, Rehovot 76100, Israel.
authors.forename: Assaf
authors.initials: A
authors.lastname: Zeira
authors.affiliation: Department of Materials and Interfaces, The Weizmann Institute of Science, Rehovot 76100, Israel.
authors.forename: Rivka
authors.initials: R
authors.lastname: Maoz
authors.affiliation: Department of Materials and Interfaces, The Weizmann Institute of Science, Rehovot 76100, Israel.
authors.forename: Jacob
authors.initials: J
authors.lastname: Sagiv