title: Low-dielectric constant insulators for future integrated circuits and packages.
abstract: Future integrated circuits and packages will require extraordinary dielectric materials for interconnects to allow transistor advances to be translated into system-level advances. Exceedingly low-permittivity and low-loss materials are required at every level of the electronic system, from chip-level insulators to packages and printed wiring boards. In this review, the requirements and goals for future insulators are discussed followed by a summary of current state-of-the-art materials and technical approaches. Much work needs to be done for insulating materials and structures to meet future needs.
authors.affiliation: Georgia Institute of Technology, School of Chemical and Biomolecular Engineering, Atlanta, GA 30332-0100, USA. kohl@gatech.edu
authors.forename: Paul A
authors.initials: PA
authors.lastname: Kohl
mesh_terms: D004581:Electronics / Q000295:instrumentation* / Q000379:methods* / Q000639:trends*; D004867:Equipment Design; D005544:Forecasting; D055616:Microtechnology / Q000295:instrumentation* / Q000379:methods*; D015394:Molecular Structure; D009930:Organic Chemicals / Q000737:chemistry
chemical_list: D009930:Organic Chemicals