title: Passivation coating on electrospun copper nanofibers for stable transparent electrodes.
abstract: Copper nanofiber networks, which possess the advantages of low cost, moderate flexibility, small sheet resistance, and high transmittance, are one of the most promising candidates to replace indium tin oxide films as the premier transparent electrode. However, the chemical activity of copper nanofibers causes a substantial increase in the sheet resistance after thermal oxidation or chemical corrosion of the nanofibers. In this work, we utilize atomic layer deposition to coat a passivation layer of aluminum-doped zinc oxide (AZO) and aluminum oxide onto electrospun copper nanofibers and remarkably enhance their durability. Our AZO-copper nanofibers show resistance increase of remarkably only 10% after thermal oxidation at 160 °C in dry air and 80 °C in humid air with 80% relative humidity, whereas bare copper nanofibers quickly become insulating. In addition, the coating and baking of the acidic PEDOT:PSS layer on our fibers increases the sheet resistance of bare copper nanofibers by 6 orders of magnitude, while the AZO-Cu nanofibers show an 18% increase.
authors.affiliation: Department of Materials Science and Engineering, Stanford University, Stanford, California 94305, USA.
authors.forename: Po-Chun
authors.initials: PC
authors.lastname: Hsu
authors.forename: Hui
authors.initials: H
authors.lastname: Wu
authors.forename: Thomas J
authors.initials: TJ
authors.lastname: Carney
authors.forename: Matthew T
authors.initials: MT
authors.lastname: McDowell
authors.forename: Yuan
authors.initials: Y
authors.lastname: Yang
authors.forename: Erik C
authors.initials: EC
authors.lastname: Garnett
authors.forename: Michael
authors.initials: M
authors.lastname: Li
authors.forename: Liangbing
authors.initials: L
authors.lastname: Hu
authors.forename: Yi
authors.initials: Y
authors.lastname: Cui
mesh_terms: D000327:Adsorption; D003300:Copper / Q000737:chemistry*; D004566:Electrodes; D004595:Electroplating / Q000379:methods*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D053758:Nanoparticles / Q000737:chemistry* / Q000648:ultrastructure*; D010316:Particle Size; D012031:Refractometry; D012399:Rotation
chemical_list: D003300:Copper