title: Adhesion to Er:YAG laser and bur prepared root and crown dentine.
abstract: BACKGROUND
  The purpose of this study was to evaluate the bond strengths between dentine and resin composite obtained after Er:YAG laser treatment of crown or root dentine used together with self-etch and total-etch adhesive systems.
  
  
  METHODS
  One etch-and-rinse adhesive (Single Bond, 3M, USA) and one self-etch system (Clearfil SE Bond, Kuraray, Japan) were applied to root and crown dentine prepared with a regular bur in a turbine or with an Er:YAG laser. The shear bond strength was determined after thermocycling and statistically analysed using independent t-tests.
  
  
  RESULTS
  Crown sites bonded using Clearfil SE Bond and Single Bond adhesives yielded bond strengths similar to that of root dentine sites (p > 0.05). Clearfil SE Bond was stronger in both the lased and non-lased groups (p < 0.05). The lowest bond strength was obtained when Single Bond without acid etching was used on Er:YAG ablated dentine. When total-etch adhesive was used, there were significant differences (p < 0.05) between the laser-ablated and laser-ablated/acid-etched and bur-cut/acid-etched groups.
  
  
  CONCLUSIONS
  Er:YAG laser irradiation of root and crown dentine conducted prior to the adhesive protocol adversely affected adhesion and decreased bond strength compared with traditional preparation.
authors.affiliation: School of Dentistry, Isfahan University of Medical Sciences, Isfahan, Iran.
authors.forename: F
authors.initials: F
authors.lastname: Shirani
authors.forename: R
authors.initials: R
authors.lastname: Birang
authors.forename: M R
authors.initials: MR
authors.lastname: Malekipur
authors.forename: A
authors.initials: A
authors.lastname: Zeilabi
authors.forename: M
authors.initials: M
authors.lastname: Shahmoradi
authors.forename: S
authors.initials: S
authors.lastname: Kazemi
authors.forename: S
authors.initials: S
authors.lastname: Khazaei
mesh_terms: D017438:Bisphenol A-Glycidyl Methacrylate; D001840:Dental Bonding; D045662:Dental Etching / Q000295:instrumentation / Q000379:methods*; D003799:Dental Stress Analysis; D003804:Dentin; D017220:Dentin-Bonding Agents; D006801:Humans; D053844:Lasers, Solid-State; D019279:Resin Cements; D033081:Shear Strength; D019228:Tooth Crown; D014092:Tooth Root
chemical_list: C438313:Clearfil SE Bond; D017220:Dentin-Bonding Agents; D019279:Resin Cements; C115612:single bond; D017438:Bisphenol A-Glycidyl Methacrylate