A high sensitivity three-dimensional-shape sensing patch prepared by lithography and inkjet printing.
A process combining conventional photolithography and a novel inkjet printing method for the manufacture of high sensitivity three-dimensional-shape (3DS) sensing patches was proposed and demonstrated. The supporting curvature ranges from 1.41 to 6.24 × 10(-2) mm(-1) and the sensing patch has a thickness of less than 130 μm and 20 × 20 mm(2) dimensions. A complete finite element method (FEM) model with simulation results was calculated and performed based on the buckling of columns and the deflection equation. The results show high compatibility of the drop-on-demand (DOD) inkjet printing with photolithography and the interferometer design also supports bi-directional detection of deformation. The 3DS sensing patch can be operated remotely without any power consumption. It provides a novel and alternative option compared with other optical curvature sensors.
Institute of NanoEngineering and MicroSystems, National Tsing Hua University, Hsin Chu 30013, Taiwan. yrhuangsun@gmail.com
Yi-Ren
YR
Huang
Sheng-An
SA
Kuo
Michal
M
Stach
Chia-Hsing
CH
Liu
Kuan-Hsun
KH
Liao
Cheng-Yao
CY
Lo