Improvement of modulation bandwidth in electroabsorption-modulated laser by utilizing the resonance property in bonding wire.
We present and demonstrate a simple and cost-effective technique for improving the modulation bandwidth of electroabsorption-modulated laser (EML). This technique utilizes the RF resonance caused by the EML chip (i.e., junction capacitance) and bonding wire (i.e, wire inductance). We analyze the effects of the lengths of the bonding wires on the frequency responses of EML by using an equivalent circuit model. To verify this analysis, we package a lumped EML chip on the sub-mount and measure its frequency responses. The results show that, by using the proposed technique, we can increase the modulation bandwidth of EML from ~16 GHz to ~28 GHz.
Photonic-Wireless Convergence Components Research Department, Electronics and Telecommunications Research Institute, 138 Gajeongno, Yuseong-gu, Daejeon, South Korea. okkwon@etri.re.kr
Oh Kee
OK
Kwon
Young Tak
YT
Han
Yong Soon
YS
Baek
Yun C
YC
Chung
D000042:Absorption; D004574:Electromagnetic Fields; D004867:Equipment Design; D019544:Equipment Failure Analysis; D007834:Lasers