title: Novel temperature dependent tensile test of freestanding copper thin film structures.
abstract: The temperature dependent mechanical properties of the metallization of electronic power devices are studied in tensile tests on micron-sized freestanding copper beams at temperatures up to 400 °C. The experiments are performed in situ in a scanning electron microscope. This allows studying the micromechanical processes during the deformation and failure of the sample at different temperatures.
authors: KAI Kompetenzzentrum Automobil- und Industrie-Elektronik GmbH, 9524 Villach, Austria.
authors: M
authors: M
authors: Smolka
authors: C
authors: C
authors: Motz
authors: T
authors: T
authors: Detzel
authors: W
authors: W
authors: Robl
authors: T
authors: T
authors: Griesser
authors: A
authors: A
authors: Wimmer
authors: G
authors: G
authors: Dehm