title: Electrodeposition modeling and optimization to improve thin film patterning with orchestrated structure evolution.
abstract: Orchestrated structure evolution is an alternative nanomanufacturing approach that combines the advantages of top-down patterning and bottom-up self-organizing growth. It relies upon tool-directed patterning to create 'seed' locations on a surface from which a subsequent deposition process produces the final, merged film. Despite its demonstrated ability to reduce patterning time by orders of magnitude, our prior reliance on mass transfer limited deposition and square seed arrays resulted in extraneous film growth along pattern edges, thereby limiting the pattern quality of the final film. Here, quality improvements are demonstrated by modeling and tuning the growth mechanism of the deposition step to include charge transfer effects. In addition, a seed positioning optimization technique derived from simulated annealing is introduced as a method for relocating the seeds to minimize film overgrowth at the pattern edges. These improvements enable OSE to maintain geometric quality while substantially reducing the time and cost compared to traditional direct-write manufacturing methods.
authors: Department of Electrical Engineering, University of Washington, Seattle, WA 98195-2550, USA.
authors: Shaghayegh
authors: S
authors: Abbasi
authors: Sathana
authors: S
authors: Kitayaporn
authors: Michael J
authors: MJ
authors: Siedlik
authors: Daniel T
authors: DT
authors: Schwartz
authors: Karl F
authors: KF
authors: Böhringer