title: Ductile fracture mechanism of low-temperature In-48Sn alloy joint under high strain rate loading.
abstract: The failure behaviors of In-48Sn solder ball joints under various strain rate loadings were investigated with both experimental and finite element modeling study. The bonding force of In-48Sn solder on an Ni plated Cu pad increased with increasing shear speed, mainly due to the high strain-rate sensitivity of the solder alloy. In contrast to the cases of Sn-based Pb-free solder joints, the transition of the fracture mode from a ductile mode to a brittle mode was not observed in this solder joint system due to the soft nature of the In-48Sn alloy. This result is discussed in terms of the relationship between the strain-rate of the solder alloy, the work-hardening effect and the resulting stress concentration at the interfacial regions.
authors: Energy-Display R&D Division, Korea Electronics Technology Institute, Seongnam 463-816, Korea.
authors: Jong-Woong
authors: JW
authors: Kim
authors: Seung-Boo
authors: SB
authors: Jung