title: Tensile properties and thermal shock reliability of Sn-Ag-Cu solder joint with indium addition.
abstract: The thermal shock reliability and tensile properties of a newly developed quaternary Sn-1.2Ag-0.5Cu-0.4In (wt%) solder alloy were investigated and compared to those of ternary Sn-Ag-Cu based Pb-free solder alloys. It was revealed that the Sn-1.2Ag-0.5Cu-0.4In solder alloy shows better thermal shock reliability compared to the Sn-1.0Ag-0.5Cu and Sn-3.0Ag-0.5Cu solder alloys. The quaternary alloy has higher strength than Sn-1.0Ag-0.5Cu alloy, and higher elongation than Sn-3.0Ag-0.5Cu alloy. It was also revealed that the addition of indium promotes the formation of Ag3(Sn, In) phase in the solder joint during reflow process.
authors: Division of Materials Science and Engineering, Inha University, Incheon 402-751, Republic of Korea.
authors: A-Mi
authors: AM
authors: Yu
authors: Jae-Won
authors: JW
authors: Jang
authors: Jong-Hyun
authors: JH
authors: Lee
authors: Jun-Ki
authors: JK
authors: Kim
authors: Mok-Soon
authors: MS
authors: Kim