title: Thermal resistance of light emitting diode PCB with thermal vias.
abstract: Light emitting diodes (LEDs) are already familiar for use as lighting sources in various electronic devices and displays. LEDs have many advantages such as long life, low power consumption, and high reliability. In the future, as an alternative to fluorescent lighting, LEDs are certain to receive much attention. However, in components related to advanced LED packages or modules there has been an issue regarding the heat from the LED chip. The LED chip is still being developed for use in high-power devices which generate more heat. In this study, we investigate the variation of thermal resistance in LED modules embedded with thermal vias. Through the analysis of thermal resistance with various test vehicles, we obtained the concrete relationship between thermal resistance and the thermal via structure.
authors: Advanced Material Division, Korea Institute of Industrial Technology, 7-47 Songdo-Dong, Yeonsu-Gu, Incheon 406-840, Korea.
authors: Hyo Soo
authors: HS
authors: Lee
authors: Hyung Won
authors: HW
authors: Shin
authors: Seung Boo
authors: SB
authors: Jung