title: Effect of curing temperature on nano-silver paste ink for organic thin-film transistors.
abstract: Silver (Ag) metal electrode having 20 microm channel length was printed by reverse offset printing (ROP) using nano-silver paste ink for the source/drain of organic thin-film transistors (OTFT). Specific resistance and surface roughness of printed Ag electrodes with increasing curing temperature were investigated, and surface morphology and grain growth mechanism were systematically verified using a scanning electron microscope (SEM) and atomic force microscope (AFM) in order to obtain an optimized ROP Ag electrode. The Ag electrode was applied to fabricate top-gate/bottom-contact poly(3-hexylthiophene) OTFT devices, which showed reproducible OTFT characteristics such as the field-effect mobility, threshold voltage, and an on/off-current ratio of -10(-3) cm2/Vs, 0.36 V, and -10(2), respectively.
authors: Convergence Components and Materials Research Laboratory, Electronics and Telecommunications Research Institute, Daejeon 305-700, Korea.
authors: Minseok
authors: M
authors: Kim
authors: Jae Bon
authors: JB
authors: Koo
authors: Kang-Jun
authors: KJ
authors: Baeg
authors: Yong-Young
authors: YY
authors: Noh
authors: Yong Suk
authors: YS
authors: Yang
authors: Soon-Won
authors: SW
authors: Jung
authors: Byeong-Kwon
authors: BK
authors: Ju
authors: In-Kyu
authors: IK
authors: You