title: Large-area nanoimprinting on various substrates by reconfigurable maskless laser direct writing.
abstract: Laser-assisted, one-step direct nanoimprinting of metal and semiconductor nanoparticles (NPs) was investigated to fabricate submicron structures including mesh, line, nanopillar and nanowire arrays. Master molds were fabricated with high-speed (200 mm s(-1)) laser direct writing (LDW) of negative or positive photoresists on Si wafers. The fabrication was completely free of lift-off or reactive ion etching processes. Polydimethylsiloxane (PDMS) stamps fabricated from master molds replicated nanoscale structures (down to 200 nm) with no or negligible residual layers on various substrates. The low temperature and pressure used for nanoimprinting enabled direct nanofabrication on flexible substrates. With the aid of high-speed LDW, wafer scale 4 inch direct nanoimprinting was demonstrated.
authors.affiliation: Department of Mechanical Engineering, University of California, Berkeley, CA 94720, USA.
authors.forename: Daeho
authors.initials: D
authors.lastname: Lee
authors.forename: Heng
authors.initials: H
authors.lastname: Pan
authors.forename: Alex
authors.initials: A
authors.lastname: Sherry
authors.forename: Seung Hwan
authors.initials: SH
authors.lastname: Ko
authors.forename: Ming-Tsang
authors.initials: MT
authors.lastname: Lee
authors.forename: Eunpa
authors.initials: E
authors.lastname: Kim
authors.forename: Costas P
authors.initials: CP
authors.lastname: Grigoropoulos