title: Cup-shaped copper heat spreader in multi-chip high-power LEDs application.
abstract: In this study, cup-shaped copper sheets were developed to improve heat dispassion for high-power light emitting diodes (LEDs) array module (3 × 3, 4 × 4, and 5 × 5) using an electroplating technique. The cup-shaped copper sheets were directly contacted with sapphire to enhance the heat dissipation of the chip itself. The lateral emitting light extraction and heat dissipation of high-power LEDs were enhanced and efficient. The surface temperature was not only decreasing but also uniform for each LED chip with the cup-shaped copper heat spreader adoption. The high thermal transmitting performance of cup-shaped copper heat spreader allows thermal resistance reducing 0.7, 0.6, and 0.7 K/W of 3 × 3, 4 × 4, and 5 × 5 LED array module, respectively. In addition, the light output power was increased of 14, 13, and 12% with 3 × 3, 4 × 4, and 5 × 5 LEDs array module using cup-shaped copper sheet at high current injection. High heat dissipation performance and light extraction were obtained by cup-shaped copper sheet with copper bulk and silver mirror.
authors.affiliation: Graduate Institute of Precision Engineering, National Chung Hsing University, Taichung 402, Taiwan. huahorng@dragon.nchu.edu.tw
authors.forename: Ray Hua
authors.initials: RH
authors.lastname: Horng
authors.forename: Hung Lieh
authors.initials: HL
authors.lastname: Hu
authors.forename: Re Ching
authors.initials: RC
authors.lastname: Lin
authors.forename: Li Shen
authors.initials: LS
authors.lastname: Tang
authors.forename: Chen Peng
authors.initials: CP
authors.lastname: Hsu
authors.forename: Sin Liang
authors.initials: SL
authors.lastname: Ou