title: A novel 3D stacking method for Opto-electronic dies on CMOS ICs.
abstract: A high speed, high density and potentially low cost solution for realizing a compact transceiver module is presented in this paper. It is based on directly bonding an Opto-electronic die on top of CMOS IC chip and creating a photoresist ramp to bridge the big step (around 220 μm) from Opto-electronic pads to CMOS IC pads. The required electrical connection between them is realized lithographically with a process than can be scaled to full wafer production. A 12-channel transmitter based on the technique was fabricated and test shows good performance up to 12.5 Gb/s/ch.
authors.affiliation: COBRA Research School, Eindhoven University of Technology, Den Dolech 2, 5600MB Eindhoven, The Netherlands. p.duan@tue.nl
authors.forename: Pinxiang
authors.initials: P
authors.lastname: Duan
authors.forename: Oded
authors.initials: O
authors.lastname: Raz
authors.forename: Barry E
authors.initials: BE
authors.lastname: Smalbrugge
authors.forename: Jeroen
authors.initials: J
authors.lastname: Duis
authors.forename: Harm J S
authors.initials: HJ
authors.lastname: Dorren