title: Thermal stabilization of a microring modulator using feedback control.
abstract: We describe and demonstrate the use of a feedback control system to thermally stabilize a silicon microring modulator subjected to a thermally volatile environment. Furthermore, we establish power monitoring as an effective and appropriate mechanism to infer the temperature drift of a microring modulator. Our demonstration shows that a high-performance silicon microring-based device, normally inoperable in thermally volatile environments, can maintain error-free performance when a feedback control system is implemented.
authors.affiliation: Department of Electrical Engineering, Columbia University, 500 West 120th Street, New York, New York, USA. kpadmara@ee.columbia.edu
authors.forename: Kishore
authors.initials: K
authors.lastname: Padmaraju
authors.forename: Johnnie
authors.initials: J
authors.lastname: Chan
authors.forename: Long
authors.initials: L
authors.lastname: Chen
authors.forename: Michal
authors.initials: M
authors.lastname: Lipson
authors.forename: Keren
authors.initials: K
authors.lastname: Bergman
mesh_terms: D004867:Equipment Design; D019544:Equipment Failure Analysis; D005246:Feedback; D006361:Heating / Q000295:instrumentation*; D008904:Miniaturization; D012031:Refractometry / Q000295:instrumentation*; D012666:Semiconductors; D020349:Surface Plasmon Resonance / Q000295:instrumentation*; D014159:Transducers