title: Glass microstructure capping and bonding techniques.
abstract: The capping of microfluidic features fabricated in glass substrates is achievable by various technological methods. Of the entire spectrum of possibilities (gluing, glass bonding via intermediate layers, pressure or plasma-assisted glass bonding, etc.) a detailed description of three techniques is presented here. The first is a low temperature PDMS-glass adhesion bonding, the second is medium temperature pressure assisted glass-glass bonding, and finally, high temperature glass-glass fusion bonding. All these protocols allow completion of the manufacturing process for a fully enclosed microfluidic chip. Nevertheless, as they are complementary rather than competing methods, they effectively extend the range of tools available to fabricate lab-on-a-chip microdevices. Each has its own merits and each could feasibly be used at different developmental stages of a given microfluidic device.
authors: Institut des Nanotechnologies de Lyon (INL), UMR CNRS 5270, Ecully Cedex, France. Radoslaw.Mazurczyk@ec-lyon.fr
authors: Radoslaw
authors: R
authors: Mazurczyk
authors: Colin D
authors: CD
authors: Mansfield
authors: Marcin
authors: M
authors: Lygan
mesh_terms: D000269:Adhesives / Q000737:chemistry; D004129:Dimethylpolysiloxanes / Q000737:chemistry; D005898:Glass / Q000737:chemistry*; D055616:Microtechnology / Q000379:methods*; D011312:Pressure; D013696:Temperature
chemical_list: D000269:Adhesives; D004129:Dimethylpolysiloxanes; C013830:baysilon