Hermetic electronic packaging of an implantable brain-machine-interface with transcutaneous optical data communication.
Future brain-computer-interfaces (BCIs) for severely impaired patients are implanted to electrically contact the brain tissue. Avoiding percutaneous cables requires amplifier and telemetry electronics to be implanted too. We developed a hermetic package that protects the electronic circuitry of a BCI from body moisture while permitting infrared communication through the package wall made from alumina ceramic. The ceramic package is casted in medical grade silicone adhesive, for which we identified MED2-4013 as a promising candidate.
Lab. for Biomedical Microtechnology, Department. of Microsystems Engineering, Univ. of Freiburg, Germany. schuettler@ieee.org
Martin
M
Schuettler
Fabian
F
Kohler
Juan S
JS
Ordonez
Thomas
T
Stieglitz
D000268:Adhesiveness; D001921:Brain / Q000502:physiology*; D003142:Communication; D004129:Dimethylpolysiloxanes / Q000737:chemistry; D004567:Electrodes, Implanted; D004582:Electronics, Medical; D006801:Humans; D007259:Infrared Rays; D019064:Product Packaging; D012828:Silicones / Q000737:chemistry; D012867:Skin / Q000033:anatomy & histology*; D014584:User-Computer Interface
D004129:Dimethylpolysiloxanes; D012828:Silicones