A method for stable electrical connection of a multi-channeled polyimide electrode with PCB.
We propose a novel packaging method of a thin polyimide multichannel microelectrode. For the simple electrical connection of polyimide (PI) electrodes, we made a via-hole at the interconnection pads of thin PI electrodes, and constructed a Ni ring by electroplating through the via-hole for the stable soldering and strong adhesion of the electrode to PCB. For the construction of a well-organized Ni ring, the electroplating condition was optimized, and the electrical property of the packaged electrode was evaluated. A 40 channel thin PI electrode was fabricated and packaged by the proposed method, and we performed the animal experiment with this packaged electrode for the high-resolution recording of neural signals from the skull of a rat.
School of Electrical Engineering and Department of Biomedical Engineering, College of Health Science, Korea University, Seoul, Republic of Korea. wpvmqor@korea.ac.kr
Dong-Hyun
DH
Baek
Ha-Chul
HC
Jung
Seon Min
SM
Kim
Chang-Hwan
CH
Im
James Jungho
JJ
Pak
Sang-Hoon
SH
Lee
D000818:Animals; D001921:Brain / Q000502:physiology*; D004553:Electric Conductivity; D004567:Electrodes, Implanted; D004569:Electroencephalography / Q000295:instrumentation*; D004581:Electronics / Q000295:instrumentation*; D004867:Equipment Design; D019544:Equipment Failure Analysis; D051381:Rats; D012117:Resins, Synthetic / Q000737:chemistry*
D012117:Resins, Synthetic; C029945:polyimide resin