title: Bonding of glass nanofluidic chips at room temperature by a one-step surface activation using an O2/CF4 plasma treatment.
abstract: A technical bottleneck to the broadening of applications of glass nanofluidic chips is bonding, due to the strict conditions, especially the extremely high temperatures (~1000 °C) and the high vacuum required in the current glass-to-glass fusion bonding method. Herein, we report a strong, nanostructure-friendly, and high pressure-resistant bonding method, performed at room temperature (RT, ~25 °C) for glass nanofluidic chips, using a one-step surface activation process with an O(2)/CF(4) gas mixture plasma treatment. The developed RT bonding method is believed to be able to conquer the technical bottleneck in bonding in nanofluidic fields.
authors: Nanoscience and Nanotechnology Research Center, Research Organization for the 21st Century, Osaka Prefecture University, 1-2, Sakai, Osaka 599-8570, Japan. y-xu@21c.osakafu-u.ac.jp
authors: Yan
authors: Y
authors: Xu
authors: Chenxi
authors: C
authors: Wang
authors: Lixiao
authors: L
authors: Li
authors: Nobuhiro
authors: N
authors: Matsumoto
authors: Kihoon
authors: K
authors: Jang
authors: Yiyang
authors: Y
authors: Dong
authors: Kazuma
authors: K
authors: Mawatari
authors: Tadatomo
authors: T
authors: Suga
authors: Takehiko
authors: T
authors: Kitamori