title: Fabrication of three-dimensional electrical connections by means of directed actin self-organization.
abstract: A promising approach to improve the performance of microelectronic devices is to build three-dimensional (3D) chips made of stacked circuits. However, a major hurdle lies in the fabrication of dense arrays of electrical interconnections between these layers, where accessibility is limited. Here we show that the directed growth and self-organization of actin filaments can offer a solution to this problem. We defined the shape and orientation of 3D actin networks through both micropatterning of actin nucleation factors and biochemical control of actin filament polymerization. Networks growing from two opposing layers were able to interpenetrate and form mechanically stable connections, which were then coated with gold using a selective metallization process. The electrical conductivity, robustness and modularity of the metallized self-organized connections make this approach potentially attractive for 3D chip manufacturing.
authors: Institut de Recherches en Technologies et Sciences pour le Vivant, iRTSV, Laboratoire de Physiologie Cellulaire et Végétale, CNRS/CEA/INRA/UJF, Grenoble 38054, France.
authors: Rémi
authors: R
authors: Galland
authors: Patrick
authors: P
authors: Leduc
authors: Christophe
authors: C
authors: Guérin
authors: David
authors: D
authors: Peyrade
authors: Laurent
authors: L
authors: Blanchoin
authors: Manuel
authors: M
authors: Théry
mesh_terms: D008841:Actin Cytoskeleton / Q000737:chemistry / Q000378:metabolism; D000199:Actins / Q000378:metabolism*; D000818:Animals; D004553:Electric Conductivity; D055616:Microtechnology / Q000379:methods*
chemical_list: D000199:Actins
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