title: Effects of multi-layer graphene capping on Cu interconnects.
abstract: The benefits of multi-layer graphene (MLG) capping on Cu interconnects have been experimentally demonstrated. The resistance of MLG capped Cu wires improved by 2-7% compared to Cu wires. The breakdown current density increased by 18%, suggesting that the MLG can act as an excellent capping material for Cu interconnects, improving the reliability characteristics. With a proper process optimization, MLG capped Cu interconnects could become a promising technology for high density back end-of-line interconnects.
authors: School of Materials Science and Engineering, Gwangju Institute of Science and Technology, Gwangju 500-712, Korea.
authors: Chang Goo
authors: CG
authors: Kang
authors: Sung Kwan
authors: SK
authors: Lim
authors: Sangchul
authors: S
authors: Lee
authors: Sang Kyung
authors: SK
authors: Lee
authors: Chunhum
authors: C
authors: Cho
authors: Young Gon
authors: YG
authors: Lee
authors: Hyeon Jun
authors: HJ
authors: Hwang
authors: Younghun
authors: Y
authors: Kim
authors: Ho Jun
authors: HJ
authors: Choi
authors: Sun Hee
authors: SH
authors: Choe
authors: Moon-Ho
authors: MH
authors: Ham
authors: Byoung Hun
authors: BH
authors: Lee