title: Three-dimensional imaging of copper pillars using x-ray tomography within a scanning electron microscope: a simulation study based on synchrotron data.
abstract: While microelectronic devices are frequently characterized with surface-sensitive techniques having nanometer resolution, interconnections used in 3D integration require 3D imaging with high penetration depth and deep sub-micrometer spatial resolution. X-ray tomography is well adapted to this situation. In this context, the purpose of this study is to assess a versatile and turn-key tomographic system allowing for 3D x-ray nanotomography of copper pillars. The tomography tool uses the thin electron beam of a scanning electron microscope (SEM) to provoke x-ray emission from specific metallic targets. Then, radiographs are recorded while the sample rotates in a conventional cone beam tomography scheme that ends up with 3D reconstructions of the pillar. Starting from copper pillars data, collected at the European Synchrotron Radiation Facility, we build a 3D numerical model of a copper pillar, paying particular attention to intermetallics. This model is then used to simulate physical radiographs of the pillar using the geometry of the SEM-hosted x-ray tomography system. Eventually, data are reconstructed and it is shown that the system makes it possible the quantification of 3D intermetallics volume in copper pillars. The paper also includes a prospective discussion about resolution issues.
authors: ST Microelectronics, 850 Rue Jean Monnet, 38920 Crolles, France.
authors: N
authors: N
authors: Martin
authors: J
authors: J
authors: Bertheau
authors: P
authors: P
authors: Bleuet
authors: J
authors: J
authors: Charbonnier
authors: P
authors: P
authors: Hugonnard
authors: D
authors: D
authors: Laloum
authors: F
authors: F
authors: Lorut
authors: J
authors: J
authors: Tabary